Fin-Integrated Heat-Dissipation Base Clamping for Bending Control
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Solution Overview
Problem
Conventional methods for manufacturing semiconductor modules with fin-integrated heat-dissipation bases face challenges in controlling bending and processing complexities due to the use of curved pressing jigs, which can lead to misalignment of coolant channels and reduced cooling efficiency.
Innovation Solution
A method involving a level different jig that clamps the heat-dissipation base at varying heights using a first and second jig, allowing for preliminary bending to reduce bending width and improve alignment of coolant channels, combined with a semiconductor module design that includes a fin-integrated heat-dissipation base and a semiconductor assembly, where the heat-dissipation base is made of materials like aluminum or copper with cooling fins and a cooling case to accommodate coolant channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a curved pressing jig is used to preliminarily clamp the heat-dissipation base, then bending of the heat-dissipation base is reduced, but it becomes difficult to process and maintain the pressing jig
Solution Approach 1:
The pressing jig is divided into a first pressing member and a second pressing member that can be separated from each other. The first pressing member has a first pressing surface, and the second pressing member has a second pressing surface. This segmentation allows each pressing member to be simpler in structure, easier to manufacture, and easier to maintain, while still achieving the preliminary bending effect when used together.
Solution Approach 2:
The pressing surfaces are designed with specific dimensional characteristics - the first pressing surface extends in a first direction and the second pressing surface extends in a second direction. This dimensional arrangement allows the pressing members to work together to achieve uniform preliminary bending without requiring complex curved geometries in each individual component.
2Manufacturing precision
If a curved pressing jig is used for preliminary bending, then bending control is improved, but misalignment of coolant channels occurs reducing cooling efficiency
Solution Approach 1:
The segmented pressing members with specifically oriented pressing surfaces enable controlled preliminary bending that maintains proper alignment of coolant channels. The first pressing surface extending in a first direction and the second pressing surface extending in a second direction work together to achieve bending without causing misalignment of the coolant channels.
3Ease of manufacture
If the heat-dissipation base is clamped uniformly at one height, then processing is simple, but bending width cannot be effectively reduced
Solution Approach 1:
The pressing members are designed to apply pressure at different locations with different characteristics. The first pressing member applies pressure through its first pressing surface, and the second pressing member applies pressure through its second pressing surface. This local differentiation in pressing arrangement enables effective bending width reduction while maintaining process simplicity.
Data Source
AI summary
A method for manufacturing a fin-integrated semiconductor module includes: clamping a fin-integrated heat-dissipation base using a level different jig while making the heat-dissipation base vary in height; and soldering a semiconductor assembly onto the heat-dissipation base. A semiconductor module includes a fin-integrated heat-dissipation base and a semiconductor assembly provided on the heat-dissipation base. A bending width of the heat-dissipation base is 200 μm or less.