Fin-Based Thermal SMD for Symmetric Heat Distribution in IC Packages
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Solution Overview
Problem
High-end chips with die stacking experience localized thermal hot spots, leading to reduced cooling efficiency and increased junction temperatures, which is particularly problematic in small form factor devices like smartphones, especially when supporting advanced communication technologies like 5G.
Innovation Solution
The integration of fin-based thermal surface mount devices on a laminate substrate provides an additional heat dissipation path, creating symmetric heat distribution by placing these devices proximate the active die and forming a conductive shield layer, allowing for effective heat dissipation both upward and downward from the chip stack.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If die stacking is used to reduce floor space, then area is reduced, but localized thermal hot spots are created leading to increased junction temperatures
Solution Approach 1:
The heat dissipation function is segmented into multiple independent paths: conventional downward heat sinking and upward heat dissipation through the laminate substrate. This allows heat to be distributed across different directions and pathways, preventing concentration at single hot spots while maintaining compact form factor.
Solution Approach 2:
The invention adds a vertical heat dissipation dimension by conducting heat upward through the laminate substrate via attached thermal devices. This transforms the traditionally single-direction (downward) heat dissipation into multi-directional heat flow, effectively managing thermal loads in the third dimension without increasing footprint area.
2Temperature
If conventional cooling solutions (heat sinks, heat spreaders) are increased in size to reduce junction temperatures, then temperature is reduced, but device size increases making it impractical for small form factor devices
Solution Approach 1:
The cooling system is divided into distributed thermal management components attached at multiple locations on the laminate substrate rather than relying on a single large heat sink. This segmentation allows effective heat dissipation across the device area without requiring any single component to be oversized.
Solution Approach 2:
Heat dissipation is extended into the vertical dimension by conducting heat upward through the laminate substrate to attached thermal devices. This utilizes the Z-axis for thermal management, effectively increasing the heat dissipation surface area without expanding the device's footprint on the PCB.
3Adaptability or versatility
If additional communication bands are added for 5G support, then communication capability is improved, but more devices must be crammed into reduced package size leading to high junction temperatures
Solution Approach 1:
The thermal management system is segmented into multiple independent heat dissipation paths distributed across the package, with thermal devices attached at strategic locations. This allows heat from multiple high-power communication components to be managed independently, preventing thermal interference and maintaining low junction temperatures despite increased device density.
Solution Approach 2:
The invention utilizes vertical heat conduction through the laminate substrate to provide additional thermal management dimension. This allows heat from densely packed communication devices to be dissipated upward as well as downward, effectively managing thermal loads from multiple communication bands without increasing package footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces junction temperatures, enhancing the performance of complex SoC packages by providing an additional heat dissipation path that complements conventional cooling methods, making it suitable for high-power devices in reduced package sizes.
Implementation Method 1
fin-based thermal surface mount devices on the surface of the laminate substrate proximate the active die to provide an additional heat dissipation path
Implementation Method 2
forming a conductive shield layer on the mold compound and sidewalls of the laminate substrate
Data Source
AI summary
An integrated circuit (IC) package is described. The IC package includes a laminate substrate. The IC package also includes an active die on a surface of the laminate substrate. The IC package further includes fin-based thermal surface mount devices on the surface of the laminate substrate proximate the active die to provide an additional heat dissipation path.