Process Kit Enclosure With Fin Supports for Clean Ring Exchange
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Solution Overview
Problem
Conventional methods for replacing process kit rings in semiconductor processing systems require manual intervention, leading to contamination, prolonged requalification processes, and disruptions in line yield, scheduling, and quality.
Innovation Solution
A process kit enclosure system with automated transfer capabilities, utilizing horizontal fins and support structures to secure and exchange process kit rings without opening the processing chamber, enabling robotic arm-assisted replacement and verification within the system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If manual replacement of process kit rings is performed by opening the processing chamber, then the process kit ring can be replaced, but the processing chamber becomes contaminated and requires prolonged requalification
Solution Approach 1:
The system separates the process kit ring replacement operation from the processing chamber by introducing an external FOUP (Front Opening Unified Pod) that houses the process kit rings. The FOUP acts as an independent module that can be loaded and unloaded without opening the processing chamber, allowing automated robot-mediated transfer of process kit rings between the FOUP and the chamber.
Solution Approach 2:
The FOUP serves as an intermediary container that stores process kit rings and enables their automated transfer to the processing chamber. The robot acts as a mediator that moves process kit rings between the FOUP and the chamber, eliminating the need for manual intervention and chamber opening.
2Productivity
If manual replacement of process kit rings is performed, then the process kit ring can be replaced, but line yield and scheduling are disrupted
Solution Approach 1:
The system prepares process kit rings in advance by storing them in the FOUP, which can be loaded with multiple pre-prepared process kit rings before being introduced to the processing chamber. This preliminary preparation eliminates the need for manual replacement operations during production, thereby maintaining line yield and scheduling.
Solution Approach 2:
The automated robot system performs the process kit ring replacement operation autonomously by retrieving process kit rings from the FOUP and installing them in the processing chamber without human intervention. This self-service capability reduces requalification time and maintains continuous production.
3Ease of operation
If the processing chamber is opened for process kit ring replacement, then the process kit ring can be accessed, but the system requires requalification process
Solution Approach 1:
The FOUP is designed as a nested structure where process kit rings are stored inside the FOUP container. The FOUP itself is then transferred as a complete unit to the processing chamber, allowing the robot to access and manipulate process kit rings without opening the chamber. This nested arrangement maintains chamber integrity while enabling easy access to process kit rings.
Data Source
AI summary
A process kit enclosure system includes surfaces to enclose an interior volume, a first support structure including first fins, a second support structure including second fins, and a front interface to interface the process kit enclosure system with a load port of a wafer processing system. The first and second fins are sized and spaced to hold process kit ring carriers and process kit rings in the interior volume. Each of the process kit rings is secured to one of the process kit ring carriers. The process kit enclosure system enables first automated transfer of a first process kit ring carrier securing a first process kit ring from the process kit enclosure system into the wafer processing system and second automated transfer of a second process kit ring carrier securing a second process kit ring from the wafer processing system into the process kit enclosure system.