Fine-Bump Semiconductor Loading Using Vision-Aligned Inserts
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Solution Overview
Problem
Conventional test handlers face difficulties in aligning and loading semiconductor devices with fine pitch contacts due to the complex and fine pitch contact requirements of High Bandwidth Memory (HBM) chips, which are essential for high-performance computing and graphics processing systems.
Innovation Solution
A method involving a first vision module to capture a bottom image of the semiconductor device, a second vision module to capture a top image of the insert, and a picker to align and load the device into the insert based on the identified positions of reference bumps and grooves, using a picker to adjust movement and rotation for precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional test handlers are used for HBM testing, then the testing can be performed with existing equipment, but fine pitch contact for testing the HBM becomes difficult due to the limited area and high density of contact portions
Solution Approach 1:
The patent applies preliminary action by pre-forming guide grooves on the insert surface before loading the semiconductor device. These guide grooves are positioned to correspond with the fine pitch contact portions, enabling the picker to align and load the device accurately without requiring complex real-time adjustment mechanisms. This preparatory structuring resolves the alignment difficulty inherent in fine pitch testing.
Solution Approach 2:
The patent introduces guide grooves as an intermediary element between the picker and the fine pitch contact portions. These grooves serve as a physical mediator that guides the contact portions into proper alignment, simplifying the operation of loading fine pitch devices while maintaining testing reliability.
2Productivity
If the contact portions are arranged at fine pitch in a limited area to meet HBM requirements, then the bandwidth and power efficiency are improved, but the alignment and loading process becomes more difficult
Solution Approach 1:
Guide grooves are pre-formed on the insert surface at positions corresponding to the fine pitch contact portions. This preliminary structuring enables precise alignment during loading without requiring ultra-precise positioning systems, thus maintaining manufacturing precision while supporting fine pitch arrangements that deliver high bandwidth efficiency.
Solution Approach 2:
The patent replaces complex mechanical positioning systems with a simpler guide groove structure. Instead of relying on high-precision mechanical alignment mechanisms, the guide grooves provide a passive geometric constraint that achieves the necessary alignment precision for fine pitch contacts, thereby supporting high productivity fine pitch designs.
3Measurement precision
If vision modules are used to capture images for alignment, then the alignment accuracy is improved, but the device complexity increases
Solution Approach 1:
The guide grooves serve as a visual intermediary that simplifies the imaging and alignment process. The vision modules capture images of the guide grooves and contact portions, and the grooves provide clear visual references that improve measurement precision without requiring complex image processing or multiple vision modules, thus limiting the increase in system complexity.
Data Source
AI summary
The method of loading the semiconductor device having the fine bumps into the insert according to an embodiment of the disclosure comprises: by a first vision module, capturing a bottom image of the semiconductor device picked up by a picker; by a second vision module, capturing a top image of the insert; and by the picker, loading the semiconductor device into the insert, based on the bottom image and the top image.