Fine-Grain Copper-Plated Solid Wire for Stable Arc Welding
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Solution Overview
Problem
In gas shielded arc welding using solid wires, the copper plating film on the wire surface is prone to wear, leading to unstable arcs and deteriorated feeding properties due to tip fusion and increased resistance during long-term welding.
Innovation Solution
A solid wire with a copper plating film having an average grain diameter of 600 nm or less is used, which reduces abrasion and improves slidability, thereby stabilizing the arc and enhancing feeding properties during welding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a copper plating film is formed on the solid wire surface, then tip abrasion is reduced and arc stability is improved, but the copper plating film wears out during forward and backward wire feeding, leading to feeding resistance deterioration
Solution Approach 1:
The invention changes the grain size parameter of the copper plating film to 600 nm or less, transforming the microstructure from coarse to fine grains. This parameter change enhances the film's resistance to abrasion during wire feeding while maintaining its arc-stabilizing properties, thereby extending service life without sacrificing reliability
Solution Approach 2:
The invention creates a composite structure with a steel core wire and a fine-grained copper plating film layer. The steel core provides mechanical strength and feeding properties, while the fine-grained copper layer provides arc stability and wear resistance. This composite structure resolves the contradiction by optimizing the functional properties of each layer
2Manufacturing precision
If repeated forward and backward wire feeding is performed, then welding penetration is improved, but the copper plating film abrasion increases and feeding properties deteriorate
Solution Approach 1:
By changing the grain size parameter of the copper plating film to 600 nm or less, the invention enhances the film's durability against repeated abrasion from forward and backward feeding. This allows the welding process to utilize repeated feeding for improved penetration without suffering from feeding resistance deterioration
3Ease of manufacture
If the copper plating film grain diameter is large, then manufacturing is easier, but the film wears out quickly during welding operations
Solution Approach 1:
The invention specifies a grain diameter of 600 nm or less, transforming the microstructure from easily manufacturable coarse grains to fine grains that offer superior wear resistance. This parameter change prioritizes film durability while the manufacturing process is optimized to achieve the fine grain structure through controlled deposition conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reduced grain diameter of the copper plating film minimizes damage within the welding torch, resulting in improved feeding properties and stable arc generation, even during repeated forward and backward wire feeding.
Implementation Method 1
abrasion of the copper plating film could be reduced by making a grain diameter in the copper plating film fine
Implementation Method 2
improves slidability of the solid wire
Implementation Method 3
welding is performed by using a gas containing Ar and a solid wire... while generating an arc
Implementation Method 4
molten metal of a wire tip melted is brought in contact with a molten pool
Data Source
AI summary
An arc welding method includes performing welding by using a gas and a solid wire. The gas contains Ar. The solid wire includes a steel core wire and a copper plating film formed on a surface of the steel core wire, and the copper plating film has an average grain diameter of 600 nm or less.