Fine Metal Mask Offset Compensation for OLED Evaporation
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Solution Overview
Problem
High pixel density in OLED display panels leads to increased requirements for fabrication accuracy in Fine Metal Mask (FMM) processes, resulting in defects such as color mixing due to low accuracy or poor process stability during film deposition.
Innovation Solution
A method and device for modifying film deposition positions using a mask component, which involves calculating offset displacements between mark points on the mask and substrate, determining actual forming positions, and adjusting the preset forming positions to correct for inaccuracies, thereby improving evaporation accuracy and reducing defects like color mixing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If pixel density is increased to improve display quality, then display resolution is improved, but fabrication accuracy requirements increase leading to deposition position deviations
Solution Approach 1:
The patent applies preliminary action by pre-establishing mark points on both the mask component and substrate before the film deposition process. These mark points serve as reference positions that allow for predetermined coordinate system alignment and offset calculation, enabling the system to proactively compensate for potential deposition position deviations rather than reacting to them after occurrence
Solution Approach 2:
The patent implements feedback by measuring the actual coordinates of mark points after mask-substrate alignment, calculating the offset between preset and actual coordinates, and using this offset information to compensate for deposition position deviations. The system continuously monitors and adjusts the deposition positions based on the measured alignment accuracy, forming a closed-loop control mechanism that improves manufacturing precision
2Adaptability or versatility
If mask stretching is performed to improve mask fit, then mask adaptability is improved, but offset displacement between mask and substrate increases
Solution Approach 1:
The patent introduces mark points as intermediary reference elements that mediate between the mask component and substrate. These mark points are established on both components and serve as common reference positions that allow for accurate coordinate transformation and offset calculation, enabling precise alignment compensation even when mask stretching has occurred
Solution Approach 2:
The patent applies parameter changes by dynamically adjusting the deposition position parameters based on the measured offset between mask and substrate mark points. The system calculates the coordinate offset caused by mask stretching and compensates for it by modifying the deposition position parameters, thereby maintaining manufacturing precision despite the physical changes in mask dimensions
3Manufacturing precision
If evaporation accuracy is increased to reduce color mixing, then film deposition precision is improved, but process complexity increases
Solution Approach 1:
The patent replaces complex mechanical adjustment mechanisms with a coordinate calculation and compensation system. Instead of using complex mechanical devices to physically adjust deposition positions in real-time, the system uses mathematical coordinate transformations and offset calculations to determine corrected deposition positions, simplifying the physical hardware while maintaining high evaporation accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively improves the accuracy of film deposition, reducing color mixing defects by recalculating and adjusting the deposition positions, ensuring precise alignment of light emitting materials with pixel definition layers, thus enhancing the overall quality of OLED display panels.
Implementation Method 1
a light emitting material passes through opening regions of FMM and sticks on a substrate
Implementation Method 2
when a film is evaporated on the substrate with the mask component
Data Source
AI summary
A method and device for modifying a film deposition position in a film deposition process with a mask component are disclosed. The mask component includes a mask frame and a mask body fixed to the mask frame. The method includes obtaining a first offset displacement between a plurality of second mark points on the mask component and a plurality of first mark points on the mask body, obtaining a second offset displacement between the plurality of third mark points on the substrate and the plurality of second mark points on the mask component, determining an actual offset displacement between an actual forming position and a preset forming position of the film, according to the first offset displacement and the second offset displacement, and modifying the preset forming position of the film, according to the actual offset displacement between the actual forming position and the preset forming position of the film.