Fine Conductive Patterning by Selective Sintering and Photonic Removal
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Solution Overview
Problem
Current methods for creating fine conductive tracks on substrates face challenges with accuracy, material degradation, and processing speed due to contact-based deposition and limitations in non-contact methods like LIFT, which rely on laser alignment and scanning, leading to imperfections and reduced resolution.
Innovation Solution
A contactless method involving selective material deposition, where a first material is solidified by energy beams and then non-solidified material is propelled away using controlled large area photonic exposure, allowing for precise control over the pattern without additional masks or scanning, and optionally using secondary patterns to reduce delamination forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If LIFT method is used to transfer material from donor film to substrate, then contactless deposition is achieved, but material instability during propulsion and impact causes track imperfections and reduced accuracy
Solution Approach 1:
The patent applies preliminary action by first solidifying the deposited material into a desired pattern using energy beams before propelling away the non-solidified material. This ensures the pattern is already formed and stable before the propulsion step, preventing instability-induced imperfections. The solidified pattern acts as a stable core that resists deformation during the subsequent propulsion process.
Solution Approach 2:
The patent inverts the conventional LIFT approach by first creating the pattern through selective solidification and then removing the excess material through propulsion, rather than directly propelling material to form the pattern. This reversal allows the pattern to be defined by positive construction (solidification) followed by negative removal (propulsion), significantly improving accuracy.
2Manufacturing precision
If scanning of focused laser beam is used to define tracks, then material transfer is achieved, but processing speed is limited especially for large area patterns
Solution Approach 1:
The patent merges the functions of pattern definition and material removal into a single integrated process. By using energy beams to simultaneously solidify material into the desired pattern and then propelling away the excess material in one coordinated sequence, the method eliminates the need for separate scanning operations, dramatically improving processing speed while maintaining precision.
Solution Approach 2:
The patent achieves continuity of useful action by making the pattern formation and material removal steps occur in immediate succession without interruption. The solidification step directly precedes the propulsion step, creating a continuous process flow that maximizes productivity while maintaining the precision of the defined pattern throughout the entire operation.
3Ease of operation
If intense energy pulse is applied to propel material, then contactless transfer is achieved, but deposited material is degraded reducing performance
Solution Approach 1:
The patent applies preliminary action by solidifying the material into the desired pattern before the propulsion step. This pre-solidification protects the material structure from degradation during the intense energy pulse of propulsion, as the solidified pattern has already achieved its final form and is more resistant to damage from the subsequent energy exposure.
Solution Approach 2:
The patent segments the energy application into two distinct phases: a first energy beam application for selective solidification that gently forms the pattern, and a second energy pulse for propulsion that acts only on the non-solidified material. This segmentation ensures the pattern-forming material receives minimal degrading energy exposure while still achieving contactless transfer of excess material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables high-resolution (<5 μm) contactless patterning with improved accuracy and speed, reducing material degradation and alignment issues, while maintaining the solidified pattern's adhesion to the substrate.
Implementation Method 1
solidifying the first material selectively in a first solidified pattern by one or more energy beams
Implementation Method 2
propelling non-solidified material away from the substrate by a large area photonic exposure
Data Source
AI summary
The invention aims to provide a contactless method to create small conductive tracks on a substrate. To this end a method is provided for selective material deposition, comprising depositing a first material on a substrate; followed by solidifying the first material selectively in a first solidified pattern by one or more energy beams; and followed by propelling non-solidified material away from the substrate by a large area photonic exposure, controlled in timing, energy and intensity to leave the solidified first pattern of the first material.