Fine-Pitch Interconnect Bonding With Insulating Layer Isolation
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Solution Overview
Problem
Fine-pitch interconnections in semiconductor devices are prone to electrical shorting or open circuits during the bonding process, leading to product defects, lower yield, and high manufacturing costs.
Innovation Solution
A method of forming a fine-pitch interconnection using an insulating layer over conductive pads, where the insulating layer is selectively broken through to establish electrical connections without causing shorts, using thermal compression bonding and reflow processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If fine-pitch electrical interconnects are used to maximize interconnectivity, then the number of interconnections is improved, but electrical shorting or open circuits occur during bonding
Solution Approach 1:
An insulating layer is introduced as an intermediary between the fine-pitch conductive pads. This insulating layer prevents electrical shorting between adjacent pads during the bonding process while still allowing controlled electrical connections to be made through it, thus maintaining reliability while preserving interconnectivity
Solution Approach 2:
The conductive pads are segmented by the insulating layer that selectively covers portions of the pads. This segmentation isolates adjacent conductive regions that would otherwise short together, while controlled openings in the insulating layer restore necessary electrical connections
2Adaptability or versatility
If fine-pitch electrical interconnects are used to maximize interconnectivity, then the number of interconnections is improved, but open circuits occur during bonding
Solution Approach 1:
The insulating layer acts as a protective intermediary that prevents mechanical damage and contamination of the fine-pitch interconnects during bonding, thereby preventing open circuits while maintaining the high interconnectivity provided by the fine-pitch design
Solution Approach 2:
The insulating layer is applied to the conductive pads before the bonding process begins. This preliminary protective action prevents damage to the fine-pitch interconnects during subsequent handling and bonding operations, ensuring connection reliability
3Adaptability or versatility
If fine-pitch electrical interconnects are used, then interconnectivity is improved, but product defects and manufacturing costs increase
Solution Approach 1:
The insulating layer serves as a protective intermediary that prevents defects during manufacturing processes. By preventing electrical shorts and protecting against damage, it reduces scrap rates and rework, thereby lowering manufacturing costs despite the added step of applying the insulating layer
Solution Approach 2:
The insulating layer is applied in advance to protect the fine-pitch interconnects during subsequent manufacturing steps. This preliminary protection prevents defects that would otherwise require expensive rework or result in scrap, improving overall manufacturing efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents electrical shorts and ensures reliable connections, thereby increasing component yield and reducing manufacturing costs.
Implementation Method 1
A method of forming a fine-pitch interconnection using an insulating layer over conductive pads, where the insulating layer is selectively broken through to establish electrical connections without causing shorts, using thermal compression bonding and reflow processes
Data Source
AI summary
A semiconductor device has an interconnect substrate and a plurality of conductive pads formed over a first surface of the interconnect substrate. The conductive pads have a fine pitch. An insulating layer is formed over the conductive pads. The insulating layer is formed over a side surface and a top surface of the conductive pads. An electrical component is disposed over the first surface of the interconnect substrate. The electrical component has an interconnect structure making electrical connection to the conductive pads through the insulating layer while leaving a portion of the insulating layer over a side surface of the interconnect structure. The interconnect structure breaks through the insulating layer under force and pressure by TCB to leave the portion of the insulating layer over the side surface of the interconnect structure to avoid an electrical short between the conductive pads.