Embedding Fine-Pitch Components in Component Carriers

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Solution Overview

Problem

Conventional methods face challenges in embedding fine-pitch components in cavities due to difficulties in attaching and contacting these components effectively.

Innovation Solution

A method involving a component carrier with a stack of electrically conductive and insulating layer structures, where a cavity is formed by removing a stack piece delimited by a poorly adhesive structure, and the bottom of the cavity is selectively exposed by partially removing this structure, allowing for the application of a finishing structure with a smaller lateral extension.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If conventional embedding methods are used for fine-pitch components, then component miniaturization is achieved, but attachment and contacting difficulties arise

Engineering Contradiction:

Improvecomponent sizeVSAvoidattachment and contacting difficulty

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent applies preliminary action by forming a cavity in the component carrier before embedding the fine-pitch component. The cavity is prepared with specific dimensional characteristics and surface conditions in advance, allowing the component to be easily embedded and contacted without difficulty during the assembly process. This pre-prepared structure eliminates the need for complex post-embedding modification operations.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent applies local quality by creating a cavity with specific local characteristics (such as controlled depth, width, and surface roughness) at the exact location where the fine-pitch component will be embedded. The cavity's local dimensional parameters are optimized to match the component's contact pad dimensions, ensuring proper electrical and mechanical connection while maintaining the miniaturized form factor.

Inventive Principle:

Principle #3Local quality

2Volume of moving object

If the pitch of electrical contacts is reduced for fine-pitch components, then miniaturization is enabled, but manufacturing precision requirements increase

Engineering Contradiction:

Improvecomponent pitchVSAvoidcontact structure precision

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-forming the cavity with precisely controlled dimensions before component embedding. The cavity's width, depth, and position are established in advance with high precision, creating a template that guides the subsequent component placement and contact formation. This approach transfers the precision requirement from the final assembly step to the preliminary cavity formation step, where more tolerant manufacturing processes can be applied.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent applies the intermediary principle by introducing the cavity structure as a mediator between the component carrier and the fine-pitch component. The cavity acts as an intermediate structure that accommodates the component's contact pads and facilitates electrical connection. By designing the cavity with optimized dimensions, the patent enables reduced pitch while maintaining manufacturing feasibility through the intermediary cavity structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of operation

If a cavity is formed in the component carrier, then component embedding is enabled, but structural complexity increases

Engineering Contradiction:

Improvecomponent embedding capabilityVSAvoidcomponent carrier structure

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The patent applies segmentation by dividing the component carrier structure into distinct functional regions: the main carrier body and the embedded cavity. The cavity is formed as a separate structural element with specific dimensional characteristics, allowing it to be independently optimized for component embedding while the main carrier structure maintains its structural integrity. This segmentation enables simplified manufacturing of each component while achieving complex overall functionality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies preliminary action by forming the cavity structure in advance during the component carrier manufacturing process, rather than creating it during final assembly. The cavity is prepared as part of the carrier fabrication sequence, using processes such as laser drilling or mechanical drilling, which integrates the complexity into an early stage where it can be managed more effectively. This preliminary formation simplifies the overall manufacturing flow by eliminating post-assembly cavity creation steps.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS20250063668A1Embedding Methods for Fine-Pitch Components and Corresponding Component Carriers

Publication Date: 2025.02.20 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG

AI summary

A component carrier includes: i) a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; ii) a cavity formed in the stack; iii) an electrically conductive contact structure at a bottom of the cavity; and iv) a finishing structure on the electrically conductive contact structure. The finishing structure has a smaller lateral extension than the electrically conductive contact structure.