Fine-Pitch Connector Bonding Without Load-Induced Deformation
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Solution Overview
Problem
Conventional connector mounting methods face challenges in achieving narrow pitch connectors without deformation and ensuring excellent insulation and conductivity, particularly in anisotropic connections where pressure application can cause deformation.
Innovation Solution
A method involving a thermosetting connection material with solder particles is used to join terminal arrays with a minimum inter-terminal distance of 0.8 mm or less, utilizing a reflow furnace set above the solder's melting point to bond the arrays without mechanical load, ensuring alignment and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If anisotropic connection is used to connect terminal arrays with narrow pitch, then connection is achieved, but the connector may be deformed by pressure applied by a tool at the time of final pressure bonding
Solution Approach 1:
The patent replaces the conventional mechanical pressure bonding method with a thermal bonding method using a reflow furnace. Instead of applying mechanical pressure with a tool to bond the terminal arrays, the invention uses heat to melt solder particles that are already positioned between the terminals, achieving bonding through thermal energy rather than mechanical force. This eliminates the deformation issue caused by pressure application while maintaining the ability to connect narrow pitch terminals.
Solution Approach 2:
The patent changes the bonding parameter from mechanical pressure to thermal energy. By controlling the temperature in the reflow furnace to melt the solder particles, the bonding process transitions from a pressure-driven mechanism to a temperature-driven mechanism. This parameter change allows for deformation-free bonding of narrow pitch connectors while achieving reliable electrical and mechanical connection.
2Manufacturing precision
If conventional connector mounting with resist for terminal array is used, then mounting is achieved, but further reduction of pitch is difficult
Solution Approach 1:
The patent replaces the resist-based alignment and bonding method with a solder particle-based thermal bonding method. Instead of using resist patterns to guide and constrain the bonding process, the invention uses precisely positioned solder particles that melt and bond the terminals together through thermal energy. This approach eliminates the pitch limitations imposed by resist fabrication capabilities and enables connection of terminals with pitch of 0.8 mm or less.
Solution Approach 2:
The patent transitions from a chemically-based resist system to a thermally-based solder melting system. By changing the bonding mechanism from chemical adhesion through resist to thermal bonding through melted solder, the invention overcomes the pitch reduction barriers associated with conventional resist methods and achieves reliable connection at finer pitches.
3Strength
If pressure bonding is used to connect terminal arrays, then bonding is achieved, but deformation occurs preventing cable insertion
Solution Approach 1:
The patent replaces mechanical pressure bonding with thermal solder bonding. Instead of applying continuous mechanical pressure that deforms the connector body, the invention uses brief thermal energy to melt solder particles that then cool and solidify, creating strong bonds without sustained mechanical stress on the connector structure. This preserves the connector's shape and functionality for cable insertion while achieving bonding strength.
Solution Approach 2:
The patent utilizes the phase transition of solder particles from solid to liquid and back to solid. The solder particles are heated to melt and flow, bonding the terminals together, then cooled to solidify and create strong mechanical and electrical connections. This phase transition mechanism achieves bonding strength without the need for continuous mechanical pressure, thereby preventing connector deformation and ensuring cable insertability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method suppresses deformation, achieves excellent insulation and conductivity, reduces space and weight, and lowers costs while allowing for fine pitch connections.
Implementation Method 1
a step of joining the first terminal array and the second terminal array without a load by using a reflow furnace set to a temperature equal to or higher than the melting point of the solder particles
Implementation Method 2
a step of fixing, on a first terminal array of a substrate, a connector having a second terminal array having a minimum inter-terminal distance of 0.8 mm or less inside a bonding surface to be bonded with the substrate via a thermosetting connection material containing solder particles
Data Source
AI summary
A method for manufacturing a connection body capable of suppressing deformation of a connector having a terminal array with a narrow pitch and obtaining excellent insulation and conductivity, and the connection body. The method includes: a step of fixing, on a first terminal array of a substrate, via a thermosetting connection material containing solder particles, a connector having a second terminal array having a minimum inter-terminal distance of 0.8 mm or less in the first terminal array and the second terminal array inside a bonding surface to be bonded with the substrate, and a step of joining the first terminal array and the second terminal array without a load by using a reflow furnace set to a temperature equal to or higher than the melting point of the solder particles.