IC Substrate Functional Inlays for Fine-Pitch Reliable Mounting
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Solution Overview
Problem
Conventional approaches face challenges in forming compact and reliable integrated circuit substrates with high functionality and small pitch, particularly for surface mounting integrated circuit components, as they require mechanical robustness and electrical reliability under harsh conditions.
Innovation Solution
An integrated circuit substrate with a support structure having at least one hole and multiple functional inlays placed side by side, achieving a pitch of not more than 150 µm, which includes embedding various functional elements such as capacitors, security components, and thermal management structures to provide enhanced functionality and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional approaches are used to form IC substrates, then manufacturing simplicity is maintained, but the substrate cannot achieve both compact size and high functionality with small pitch
Solution Approach 1:
The substrate is divided into a support structure and multiple functional inlays that can be independently designed and manufactured. Each inlay provides specific functionality (capacitors, security components, thermal management) and can be selectively placed within holes of the support structure, enabling high functionality without proportionally increasing overall substrate complexity
Solution Approach 2:
Functional inlays are embedded within holes of the support structure, creating a nested configuration where functional elements are integrated into the substrate volume. This allows multiple functional components to be housed within the substrate footprint, achieving compact design with enhanced functionality
2Adaptability or versatility
If multiple functional elements are integrated into the substrate, then functionality is enhanced, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is segmented into independent stages: fabricating the support structure, separately manufacturing functional inlays, and assembling them by placing inlays into holes. This modular approach allows each component to be optimized and manufactured using appropriate processes, then combined, reducing overall manufacturing complexity despite enhanced functionality
Solution Approach 2:
Functional inlays are pre-fabricated as separate components before being integrated into the substrate. This preliminary manufacturing of inlays allows for specialized fabrication processes to be applied to each inlay type, and quality can be verified before assembly, simplifying the final substrate manufacturing process
3Volume of moving object
If pitch is reduced to increase component density, then compactness is achieved, but mechanical robustness and electrical reliability deteriorate
Solution Approach 1:
The support structure provides localized mechanical support and electrical isolation around each functional inlay, ensuring that small pitch between inlays does not compromise overall reliability. Each inlay is independently supported and electrically managed, maintaining robustness even at high density configurations
Data Source
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AI summary
An integrated circuit substrate (100) for surface mounting an integrated circuit component (102) thereon, wherein the integrated circuit substrate (100) comprises a support structure (104) having at least one hole, and at least two functional inlays (108) placed inside said at least one hole side by side, wherein a pitch (D) at an integrated circuit component mounting side (140) of the integrated circuit substrate (100) is not more than 150 µm.