Fine-Pitch Conductive Line Layout With Bulging Ends for IC Scaling
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Solution Overview
Problem
The challenge lies in manufacturing highly scaled and integrated semiconductor devices with fine conductive lines at a fine pitch, where existing techniques struggle to form repeating fine conductive lines with a fine width at a fine pitch effectively.
Innovation Solution
The proposed solution involves an integrated circuit (IC) device design where conductive lines are arranged parallel to each other at a fine pitch, with specific configurations such as bulging end portions and linear line portions, and a method of manufacturing that includes forming a target layer on a substrate, creating reference patterns, and using spacers to define the conductive lines' geometry through etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional manufacturing techniques are used, then existing processes can be maintained, but fine conductive lines at fine pitch cannot be formed effectively
Solution Approach 1:
The conductive line is divided into multiple segments: a linear line portion and one or more bulging end portions. This segmentation allows different portions of the same conductive line to have different geometries optimized for their specific functions, enabling fine pitch formation while maintaining manufacturability through standardized linear sections combined with specialized bulging sections.
Solution Approach 2:
Different portions of the conductive line are given different local qualities: the linear line portion has uniform geometry for consistent electrical properties and easy manufacturing, while the bulging end portions have expanded geometry for enhanced connectivity and signal distribution. This local differentiation resolves the contradiction by allowing precision where needed without complicating the entire manufacturing process.
2Quantity of substance
If conductive lines are arranged at fine pitch, then integration density is improved, but manufacturing precision requirements increase
Solution Approach 1:
The linear line portion is formed first as a precise, uniform base structure that defines the pitch and spacing of conductive lines. The bulging end portions are then added in subsequent manufacturing steps. This preliminary action establishes the fine pitch geometry early in the process when precision requirements are most critical, before additional complex features are added.
Solution Approach 2:
The conductive lines extend in multiple dimensions: the linear line portion provides precise control in the lateral dimension for fine pitch, while the bulging end portions add vertical dimensionality through their expanded cross-sections. This multi-dimensional approach allows fine pitch arrangement without compromising manufacturing precision in any single dimension.
3Length of moving object
If conductive lines have fine width, then device scaling is improved, but manufacturing difficulty increases
Solution Approach 1:
The linear line portion is formed with homogeneous geometry and material properties, creating a uniform structure that is straightforward to manufacture at fine dimensions. This homogeneous base structure reduces manufacturing difficulty compared to entirely non-uniform fine lines, while still achieving the required fine width for device scaling.
Solution Approach 2:
By segmenting the conductive line into linear portions (easy to manufacture at fine width) and bulging end portions (enhancing functionality), the invention makes fine width fabrication more achievable. The majority of each conductive line consists of the easily manufactured linear section, reducing overall fabrication complexity while maintaining fine dimensions.
Data Source
AI summary
An integrated circuit (IC) device includes a first conductive line in a closed curve defining a local area on a substrate. The first conductive line has a first end portion and a second end portion. A second conductive line is outside the local area. The second conductive line has a linear line portion along the closed curve and a bulging end portion along the closed curve. The bulging end portion protrudes from the linear line portion toward the first end portion of the first conductive line in the second lateral direction and protrudes further than the first end portion to the outside of the local area. A method of manufacturing an IC device includes forming a first reference pattern having a mandrel hole. A reference spacer is formed inside the mandrel hole. A second reference pattern is formed. The second reference pattern has a shift hole.