Fine-Pitch Probe Card Assembly With Direct Metal Bonded Probes
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Solution Overview
Problem
As semiconductor device pads become smaller, testing them becomes more difficult due to the need for fine pitch systems that are both cost-effective and reliable, with existing probe cards facing challenges in manufacturing cost and durability.
Innovation Solution
The development of probe cards with fine pitch probes, comprising a probe tip, beam, and stand, directly bonded to a substrate via metal bonds, using materials like silicon and oxide structures, and fabrication methods involving direct metal bonding and 3D printing to create durable and reliable probe structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional probe cards are used for fine pitch testing, then testing capability is maintained, but manufacturing cost increases and durability decreases
Solution Approach 1:
The probe card is divided into modular probe structures, each comprising a probe tip, probe beam, and probe stand that can be independently fabricated and then assembled through direct metal bonding. This segmentation allows for specialized manufacturing processes for each component while simplifying the overall assembly process and reducing total manufacturing cost.
Solution Approach 2:
The probe structures utilize composite material design where the probe tip, probe beam, and probe stand are made from different materials optimized for their specific functions. The direct metal bonding of dissimilar metals creates a composite structure that achieves fine pitch dimensions while maintaining cost-effectiveness through material selection and manufacturing process optimization.
2Manufacturing precision
If conventional probe cards are used for fine pitch testing, then testing capability is maintained, but reliability and lifespan decrease
Solution Approach 1:
The probe beam is designed with a spiral shape from top down view, which provides mechanical flexibility and stress distribution. This curved geometry allows the probe beam to deflect and return to its original position without permanent deformation, significantly improving the durability and lifespan of the probe card while maintaining fine pitch testing capability.
Solution Approach 2:
The probe structures are disposed within patterned dielectric layers and oxide structures that provide mechanical support and electrical isolation. The probe stand is disposed in a silicon structure or oxide structure, creating a nested configuration that protects the delicate probe tip and beam while maintaining fine pitch dimensions and improving overall reliability.
3Measurement precision
If probe pitch is reduced below 40 microns, then testing resolution improves, but manufacturing complexity increases
Solution Approach 1:
The probe beam extends in a second direction different than the probe tip direction, creating a three-dimensional probe structure. This dimensional arrangement allows for fine pitch in the probe tip array while the probe beam can be routed through multiple layers and dielectric structures, simplifying the manufacturing process by separating the fine pitch requirement from the overall structural complexity.
Solution Approach 2:
Patterned dielectric layers and oxide structures serve as intermediaries between the probe metal structures and the substrate. These intermediate layers provide electrical isolation, mechanical support, and structural definition, allowing fine pitch probe tips to be manufactured without requiring the entire probe card structure to be equally complex.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables durable and reliable testing of semiconductor devices with fine pitch probes, reducing manufacturing costs and increasing the lifespan of probe cards.
Implementation Method 1
The probe stand is directly bonded to the conductive feature of the substrate via direct metal bonds
Implementation Method 2
The probe beam may be directly bonded to the probe stand via direct metal bonds
Implementation Method 3
The probe tip may be directly bonded to the probe beam via direct metal bonds
Data Source
AI summary
Embodiments herein provide for probe cards and methods related thereto. A probe card comprises a probe and a substrate. The probe comprises a probe stand, a probe beam, and a probe tip. The probe tip and probe stand extend in a first direction, and the probe beam extends in a second direction different than the first direction. The substrate comprises a conductive feature disposed in a material layer. The probe stand of the probe is directly bonded to the conductive feature of the substrate via direct metal bonds.