Fine-Pitch Routing Pattern Layout to Prevent Pattern Collapse
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Solution Overview
Problem
The increasing complexity and integration of integrated circuits lead to smaller line widths and spaces in routing patterns, making them prone to collapse, which reduces product reliability and yield.
Innovation Solution
A routing pattern design that includes a plurality of linear features and an interconnection feature with a recess curving inwards, where the interconnection feature has a wider line width than the linear features, helping to alleviate pattern collapse issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the line width and space of routing pattern are reduced to increase integration, then the integration complexity increases, but the pattern becomes prone to collapse
Solution Approach 1:
The patent applies local quality by varying the line width at different locations within the routing pattern. Specifically, the line width is adjusted locally at the interconnection feature (making it wider) while maintaining smaller line widths in other regions, thereby providing targeted structural support where needed without compromising overall integration density.
Solution Approach 2:
The patent employs parameter changes by modifying the line width parameter within the routing pattern design. The interconnection feature has a different (wider) line width parameter compared to the linear features, creating a parameter variation that prevents collapse while maintaining fine pitch elsewhere.
2Quantity of substance
If the line width of routing pattern is reduced to increase density, then the manufacturing precision requirement increases
Solution Approach 1:
The patent applies local quality by making the interconnection feature wider than the linear features. This local variation in line width provides a manufacturing buffer zone at critical interconnection points, reducing the precision requirements for those specific areas while maintaining high density in the linear feature regions.
3Productivity
If the line width of routing pattern is reduced to increase integration, then the process window decreases
Solution Approach 1:
The patent employs parameter changes by introducing a wider line width parameter for the interconnection feature. This parameter change creates a more robust structure at critical points, thereby expanding the process window for manufacturing while still allowing fine pitch linear features for high integration.
Data Source
AI summary
A routing pattern is provided. The routing pattern includes a first routing region, a second routing region and an interconnection region. The first routing region includes a plurality of first conductive lines extending along a first direction. The plurality of first conductive lines has a first pitch along a second direction perpendicular to the first direction. The second routing region includes a plurality of second conductive lines extending along the first direction. The plurality of second conductive lines has a second pitch along the second direction, and the second pitch is approximately equal to the first pitch. The interconnection region includes two body parts and a connecting part connecting to the body parts. The body parts are disposed separately along the first direction. A width of the connecting part along the second direction is smaller than a width of the body parts along the second direction.