Fine Pitch Substrate Manufacturing via Detachable Core Carrier
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Solution Overview
Problem
The computer industry faces challenges in miniaturizing semiconductor package structures to increase component density and reduce costs while maintaining performance, particularly in portable devices, where existing technologies fail to fully address integration, space savings, and cost reduction.
Innovation Solution
A method of manufacturing a support system involving a carrier with a detachable core and foil, a mask with holes, a bottom conductive layer, an interior insulation layer, and conductive connectors, allowing for the formation of coreless substrates with fine pitch and low-cost production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor package structures are miniaturized to increase component density, then packaging density improves, but manufacturing complexity and cost control become more difficult
Solution Approach 1:
The manufacturing process is divided into distinct stages: forming the carrier with detachable core, depositing conductor patterns, removing the core, and completing the substrate. This segmentation allows each step to be optimized independently, managing manufacturing complexity while achieving fine pitch and high density
Solution Approach 2:
The carrier with detachable core is prepared in advance before conductor deposition. The core provides a temporary support structure that enables precise conductor pattern formation at fine pitches. This preliminary preparation simplifies the overall manufacturing process by providing a stable base for subsequent complex operations
2Adaptability or versatility
If more integrated circuits are integrated into a single package, then functionality increases, but physical space requirements increase
Solution Approach 1:
The patent enables high-density integration by transitioning to fine pitch conductor patterns and thin substrate structures. The multi-layer conductor and insulation arrangement utilizes vertical stacking to achieve high integration without proportionally increasing planar footprint, effectively moving the problem into the third dimension
3Ease of manufacture
If conventional substrate manufacturing methods are used, then production is simpler, but temperature warpage occurs during processing
Solution Approach 1:
The patent addresses temperature warpage by carefully controlling material selection and processing parameters. The carrier foil, insulation layers, and conductor materials are selected and configured to minimize differential thermal expansion. The detachable core removal process is optimized to eliminate warpage caused by core presence during high-temperature processing
Data Source
AI summary
A method of manufacture of a support system includes: forming a carrier having a detachable core and a carrier foil directly on the detachable core; forming a mask directly on the carrier foil, the mask having a mask hole through the mask; forming a bottom conductive layer within the mask hole and directly on the carrier foil; forming an interior insulation layer directly on the bottom conductive layer and the mask after the bottom conductive layer is formed within the mask hole; partially removing the interior insulation layer leaving an insulation hole through the interior insulation layer; forming a conductive connector completely within the insulation hole; and forming a bottom exterior insulation layer over the bottom conductive layer and the mask.