Fine-Pitch Test Socket Contact Structure for Stable Signal Paths
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Solution Overview
Problem
Existing test sockets for semiconductor devices face issues with mechanical instability and electrical signal distortion due to repeated use, leading to reduced lifespan and increased costs, particularly in fine pitch applications where insulation distance and conductivity are critical.
Innovation Solution
A hybrid contact and test socket device formed by rolling a metal plate into a cylindrical shape with elastic portions and filled with a conductive and elastic filler, providing improved mechanical stability and electrical conductivity while maintaining elasticity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pin-type test socket with spiral or curved contact pin structure is used to provide elasticity, then mechanical contact capability is improved, but signal loss increases due to long current path and production complexity increases for fine pitch applications
Solution Approach 1:
The contact structure is divided into multiple contact points arranged in a matrix pattern, where each contact point makes direct contact with corresponding pads. This segmentation eliminates the need for long current paths through spiral structures, reducing signal loss while maintaining mechanical contact capability through distributed direct contacts.
Solution Approach 2:
The invention transitions from a single-point contact structure to a matrix array of contact points distributed across the contact surface. This dimensional expansion allows simultaneous multiple contact paths, reducing the electrical path length for each individual contact while maintaining overall mechanical stability through the distributed array structure.
2Reliability
If pin-type test socket with spiral or curved contact pin structure is used to provide elasticity, then mechanical contact capability is improved, but device complexity and production cost increase remarkably
Solution Approach 1:
Multiple contact points are integrated into a single planar contact structure that can be manufactured as one piece using conventional PCB techniques. This merging eliminates the need for complex assembly of multiple spiral pins, reducing production complexity while maintaining mechanical contact capability through the distributed contact point array.
Solution Approach 2:
The invention replaces complex mechanical spiral pin structures with a planar circuit board-based contact structure. This substitution uses the rigidity and precision of PCB manufacturing to achieve stable mechanical contact, eliminating the need for complex mechanical elasticity mechanisms while reducing production complexity.
3Ease of manufacture
If rubber-type test socket with conductive silicon portion is used, then ease of manufacture is improved, but insulation distance is insufficient in fine pitch applications leading to circuit short
Solution Approach 1:
The invention uses a planar circuit board structure with controlled trace routing and spacing to provide electrical insulation between adjacent contact points. This approach provides precise control over insulation distances through standard PCB design rules, preventing circuit shorts in fine pitch applications while maintaining ease of manufacture through conventional PCB fabrication processes.
4Productivity
If test socket is used repeatedly for testing, then productivity is improved, but mechanical and electrical characteristics are degraded leading to reduced lifespan
Solution Approach 1:
The contact structure uses uniform material properties and consistent geometric patterns across all contact points, ensuring uniform stress distribution and contact pressure during repeated testing. This homogeneity prevents localized wear and deformation, maintaining mechanical and electrical characteristics over extended use while supporting high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid test socket device extends the lifespan of test sockets, enhances electrical characteristics, and is suitable for fine pitch devices by maintaining stable connections and reducing signal loss, thus addressing the limitations of pin-type and rubber-type test sockets.
Implementation Method 1
an elastic portion obliquely extending into a lateral and downward direction from the upper head portion and formed of a strip spirally bent into a cylindrical shape
Implementation Method 2
filled with a conductive and elastic filler
Data Source
AI summary
The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.