Fine-Pitch Test Socket Contact Structure for Stable Signal Paths
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Solution Overview
Problem
Existing test sockets for semiconductor devices face issues with mechanical instability, signal loss due to long current paths, and reduced service life due to contamination and elasticity loss, particularly in fine pitch devices, leading to increased production costs and frequent replacements.
Innovation Solution
A hybrid contact and test socket device is developed, featuring a contact formed by rolling a metal plate into a cylindrical shape with elastic portions and a filler having conductivity and elasticity, which provides stable electrical connections and extended service life by overcoming the limitations of pin-type and rubber-type test sockets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pin-type test socket with spiral or curved contact pin structure is used to provide elasticity, then mechanical contact capability is improved, but current path becomes long leading to signal loss
Solution Approach 1:
The contact structure is divided into multiple contact points arranged in a straight line, with each contact point providing independent elastic contact capability through its own spring element, eliminating the need for long spiral or curved paths while maintaining mechanical reliability
Solution Approach 2:
The contact pins are arranged in a straight linear configuration rather than spiral or curved three-dimensional paths, reducing the current path length while maintaining elastic contact capability through vertical spring elements
2Reliability
If pin-type test socket with complex housing structure is used for fine pitch devices, then mechanical stability is improved, but production complexity and cost are remarkably increased
Solution Approach 1:
The housing structure provides localized support and positioning features only where needed for fine pitch contact alignment, rather than complex overall structure, reducing production complexity while maintaining mechanical stability at critical contact points
Solution Approach 2:
The contact pin dimensions and spacing parameters are optimized for fine pitch applications, allowing simple housing structure to achieve mechanical stability through precise parameter control rather than complex structural design
3Reliability
If rubber-type test socket with conductive silicon portion is used, then elasticity and electrical connection are improved, but service life is reduced due to contamination and elasticity loss
Solution Approach 1:
The contact structure uses durable metallic spring elements that can be easily replaced if needed, rather than irrecoverable rubber materials that lose elasticity and accumulate contamination, extending service life through replaceability
Solution Approach 2:
The test socket combines metallic spring elements for elastic contact with insulating housing materials, creating a composite structure that provides both electrical connection quality and resistance to contamination, extending service life
4Productivity
If test socket is used repeatedly for testing, then productivity is improved, but mechanical and electrical characteristics are degraded
Solution Approach 1:
The spring elements are pre-designed with adequate elastic force and durability margins to withstand repeated compression cycles, cushioning against degradation and maintaining contact characteristics throughout extended service life
Solution Approach 2:
The test socket design allows for easy replacement of wear-prone contact elements while retaining the durable housing and electrical connection structures, recovering functional value by replacing only degraded components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid contact and test socket device achieves superior electrical characteristics and extended service life, suitable for fine pitch devices, by reducing signal loss and mechanical instability while maintaining stable connections and reducing production costs.
Implementation Method 1
an elastic portion obliquely extending into a lateral and downward direction from the upper head portion and formed of a strip spirally bent into a cylindrical shape
Implementation Method 2
a filler having conductivity and elasticity, which fills an inner space of the contact
Data Source
AI summary
The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.