FinFET Fin Track Layout for Higher Drive in Fixed Cell Height
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Solution Overview
Problem
Current integrated circuit (IC) manufacturing methods do not efficiently support the placement of cells with FinFETs having differing numbers of fins, limiting the driving ability of IC devices.
Innovation Solution
The implementation of a fin track arrangement in IC layout diagrams that allows for the placement of cells with FinFETs having varying numbers of fins, enabling increased driving ability without increasing cell area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If current IC manufacturing methods are used with uniform fin configurations, then manufacturing process is simple, but driving ability of IC devices is limited
Solution Approach 1:
The patent divides the fin structure into multiple discrete fin tracks that can be independently configured. Each fin track represents a separate segment that can be selectively formed or omitted in different cell regions, allowing the number of fins to be segmented and varied across different FinFETs within the same cell, thereby increasing driving ability without requiring a completely new manufacturing process.
Solution Approach 2:
The patent implements local quality by allowing different fin track configurations in different spatial locations within the cell. Specifically, first-type fin tracks and second-type fin tracks are arranged in different regions, enabling certain FinFETs to have more fins (higher driving ability) while others have fewer fins, tailored to local circuit requirements. This local differentiation resolves the contradiction by providing adaptability where needed while maintaining simplicity in regions where it suffices.
2Adaptability or versatility
If the number of fins is increased to improve driving ability, then performance increases, but cell area expands
Solution Approach 1:
The patent transitions from a uniform two-dimensional fin arrangement to a multi-dimensional configuration by introducing vertical stacking of fins in specific tracks. The first-type fin tracks contain a greater number of fins arranged in the vertical dimension, allowing increased driving ability through vertical scaling rather than horizontal expansion. This dimensional change enables more fins to be packed into the same cell footprint, improving performance without proportionally increasing cell area.
Solution Approach 2:
The patent creates a universal fin track arrangement system that can accommodate multiple fin configurations (first-type with more fins, second-type with fewer fins) within a single standardized cell structure. This multi-functional framework allows the same cell layout to support varying driving abilities by simply activating or deactivating specific fin tracks, rather than requiring separate cell designs for different performance levels. The universal structure prevents area expansion by reusing the same spatial framework.
3Adaptability or versatility
If varying numbers of fins are implemented in different FinFETs, then driving ability increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies preliminary action by pre-defining the fin track patterns and their locations during the cell design phase. The first-type and second-type fin tracks are predetermined in their positions and configurations, allowing manufacturing equipment to follow established templates rather than creating variable structures from scratch. This preliminary structuring reduces manufacturing precision requirements by converting a complex variable-structure problem into a pattern-matching problem with well-defined tolerances.
Solution Approach 2:
The patent uses copying by replicating standardized fin track modules (first-type and second-type) across different cell regions. Instead of manually configuring each fin structure individually, the same fin track designs are copied and pasted into appropriate locations based on the desired driving ability. This modular copying approach reduces manufacturing precision requirements by reusing proven, well-characterized structures rather than creating new variable structures, thereby maintaining adaptability while simplifying fabrication.
Data Source
AI summary
A method of manufacturing an IC structure includes forming a first plurality of fins extending in a first direction on a substrate, a second plurality of fins extending adjacent to the first plurality of fins, a third plurality of fins extending adjacent to the second plurality of fins, and a fourth plurality of fins extending adjacent to the third plurality of fins. Each fin of the first and fourth pluralities of fins includes one of an n-type or p-type fin, each fin of the second and third pluralities of fins includes the other of the n-type or p-type fin, each of the first and third pluralities of fins includes a first total number of fins, and each of the second and fourth pluralities of fins includes a second total number of fins fewer than the first total number of fins.