FinFET Gate Dielectric Layout for Higher Drive Current

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Solution Overview

Problem

FinFETs face challenges in achieving higher drive currents with smaller dimensions due to complex ion implantation processes and geometrical effects, requiring additional fabrication steps for low power transistors.

Innovation Solution

A method for manufacturing FinFETs involving multi-patterning processes, including photolithography and self-aligned techniques, to form fin structures, followed by the formation of isolation insulating layers, sacrificial gate structures, and epitaxial source/drain regions, with additional steps to optimize gate dielectric layers for low power consumption and reduced leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If FinFET dimensions are reduced to increase drive current, then transistor performance is improved, but fabrication complexity and geometrical effects increase

Engineering Contradiction:
Improvedrive currentVSAvoidfabrication complexity
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by forming sacrificial structures (such as mandrels or spacers) before the final fin structure is created. These sacrificial structures serve as templates or guides that simplify the subsequent formation of the fin structures, reducing the overall fabrication complexity despite the additional steps required. The sacrificial structures are removed after transferring the pattern, leaving the desired fin geometry without requiring direct formation of complex three-dimensional structures.

Inventive Principle:
Principle #10Preliminary action

2Power

If ion implantation processes are used to achieve higher drive currents, then transistor performance is improved, but geometrical effects and process control difficulty increase

Engineering Contradiction:
Improvedrive currentVSAvoidgeometrical effects
Core Design Contradiction:
PowerVSManufacturing precision

Solution Approach 1:

The patent extracts the ion implantation process from the fin structure formation sequence by using sacrificial structures that are removed before the fin structures are created. This separation allows the ion implantation to be performed on simpler, planar sacrificial structures rather than on complex three-dimensional fin structures, thereby reducing geometrical effects and improving process control. The sacrificial structures are designed to be easily removed, leaving clean fin structures without contamination from the implantation process.

Inventive Principle:
Principle #2Taking out (Extraction)

3Loss of energy

If additional fabrication steps are added for low power transistors, then power consumption is reduced, but manufacturing complexity increases

Engineering Contradiction:
Improvepower consumptionVSAvoidfabrication steps
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent applies universality by designing sacrificial structures that serve multiple functions: they act as pattern templates, provide mechanical support during fabrication, enable selective region definition, and facilitate the formation of different transistor types (including low power transistors). This multi-functionality reduces the need for separate dedicated steps for each transistor type, as the same sacrificial structure approach can be adapted for both high power and low power device regions, thereby reducing overall fabrication complexity despite the additional steps required for low power optimization.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250352880A1Method of manufacturing semiconductor devices and semiconductor device
Publication Date: 2025.11.20 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20250352880A1 patent drawing
  • US20250352880A1 patent drawing
  • US20250352880A1 patent drawing

AI summary

In a method for manufacturing a semiconductor device, fin structure is formed over substrate, isolation insulating layer is formed over the substrate such that upper portion of the fin structure protrudes from the isolation insulating layer, first dielectric layer is formed on the upper portion of the fin structure, cover layer is formed on the first dielectric layer, the cover layer is partially removed from an upper part of the upper portion of the fin structure with the first dielectric layer, the first dielectric layer is removed from the upper part of the upper portion of the fin structure, second dielectric layer is formed on the upper part of the upper portion of the fin structure, and gate electrode is formed on the second dielectric layer and the first dielectric layer disposed on lower part of the upper portion of the fin structure.