FinFET Standard Cell Layout With Grid-Aligned Buried Power Rails

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Solution Overview

Problem

Buried power rails in semiconductor integrated circuits face challenges in providing sufficient current supply to transistors while maintaining regular placement of fin FETs, as they cannot be formed in regions with transistor sources, drains, and channels, and manufacturing variations restrict transistor size and placement.

Innovation Solution

The semiconductor integrated circuit device incorporates standard cells with fin FETs, where buried power lines are aligned along virtual grid lines, allowing for larger power lines without obstructing fin FET placement, ensuring sufficient current supply by positioning the center of the buried power lines on virtual grid lines or between them.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If buried power rails are made larger in width to provide sufficient current supply capability, then current supply capability is improved, but regular placement of fin FETs is blocked

Engineering Contradiction:
Improvecurrent supply capabilityVSAvoidregular placement of fin FETs
Core Design Contradiction:
PowerVSEase of manufacture

Solution Approach 1:

The patent introduces virtual grid lines as a reference framework to resolve the spatial conflict between wide buried power rails and fin FET placement. By aligning power rail centers with virtual grid lines (which are equally spaced in the second direction), the design enables regular fin FET placement while maintaining sufficient power rail width for current supply.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If buried power rails are positioned to avoid transistor sources, drains, and channels, then manufacturing variations are prevented, but current supply capability is reduced

Engineering Contradiction:
Improvemanufacturing variationsVSAvoidcurrent supply capability
Core Design Contradiction:
ReliabilityVSPower

Solution Approach 1:

The patent applies local quality by making buried power rails larger in size specifically in the second direction (width) for standard cells that require higher current supply. This localized adaptation allows each standard cell to have power rail dimensions optimized for its specific current requirements while maintaining proper alignment with virtual grid lines to avoid transistor regions.

Inventive Principle:
Principle #3Local quality

3Manufacturing precision

If fin FETs are restricted in size and placement positions to prevent manufacturing variations, then manufacturing precision is improved, but design flexibility is reduced

Engineering Contradiction:
Improvefin FET placement precisionVSAvoiddesign flexibility
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent creates a universal placement framework using virtual grid lines that can accommodate different fin FET sizes and standard cell configurations. The virtual grid lines serve as a common reference system that maintains manufacturing precision while allowing flexible design of various standard cells with different power rail dimensions and transistor arrangements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20230411246A1Semiconductor integrated circuit device
Publication Date: 2023.12.21 SOCIONEXT INC
  • US20230411246A1 patent drawing
  • US20230411246A1 patent drawing
  • US20230411246A1 patent drawing

AI summary

A semiconductor integrated circuit device includes a plurality of cells each having a fin FET. A plurality of fins constituting the fin FET extend in the X direction and are placed on virtual grid lines equally spaced in the Y direction. The cells include buried power lines: cells larges in size in the Y direction include buried power lines larger in width. The center position of each of the buried power lines in the Y direction is on a virtual grid line or at a center position between adjacent virtual grid lines.