FinFET Isolation Section Self-Aligned to Dummy Gate Spacer

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Solution Overview

Problem

Current semiconductor manufacturing techniques face challenges in reducing the area occupied by isolation sections in miniaturized devices, particularly in FinFETs, where multiple dummy gates are required, leading to increased costs and reduced device density.

Innovation Solution

A semiconductor arrangement and manufacturing method that self-aligns an isolation section to the space defined by a dummy gate spacer, allowing for the use of a single dummy gate and reducing the footprint of the isolation section, applicable to FinFETs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple dummy gates are used for isolation in FinFETs, then electrical isolation between devices is achieved, but the area occupied by isolation sections increases

Engineering Contradiction:
Improveelectrical isolationVSAvoidisolation section area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent extracts the isolation function from the traditional multi-dummy-gate structure and concentrates it into a single dummy gate positioned between adjacent FinFETs. This single dummy gate, combined with the fin structure, provides the necessary electrical isolation while occupying significantly less area than the conventional approach requiring two dummy gates per isolation section.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the isolation function with the fin structure itself. The fin acts as both the active device component and part of the isolation structure, eliminating the need for separate isolation regions. The single dummy gate works in conjunction with the fin to provide both device functionality and electrical isolation.

Inventive Principle:
Principle #5Merging (Combining)

2Productivity

If more devices are integrated on a wafer, then device density increases, but the area available per device decreases

Engineering Contradiction:
Improvedevice densityVSAvoidarea per device
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The patent utilizes the vertical dimension through the fin structure to achieve device functionality, allowing the device to extend in the height direction rather than requiring more lateral space. This 3D architecture enables higher device density on the wafer surface while maintaining adequate isolation between adjacent devices.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent applies isolation structures only where electrically necessary - specifically at the interfaces between adjacent FinFETs - rather than using uniform isolation across the entire device area. The single dummy gate provides localized isolation precisely where needed, minimizing the area penalty while ensuring proper electrical separation.

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If traditional isolation methods are used in miniaturized devices, then manufacturing process is well-established, but area penalty and manufacturing cost increase

Engineering Contradiction:
Improvemanufacturing process maturityVSAvoidisolation section footprint
Core Design Contradiction:
Ease of manufactureVSArea of stationary object

Solution Approach 1:

The single dummy gate is formed during the standard FinFET manufacturing process at an early stage, before the final device structures are completed. This preliminary placement of the dummy gate allows subsequent processing steps to naturally form the isolation regions without requiring additional complex steps, maintaining manufacturing simplicity while reducing area.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The single dummy gate serves multiple functions simultaneously: it acts as a placeholder for future device formation, provides electrical isolation between adjacent FinFETs, and defines the boundary for isolation region formation. This multi-functionality eliminates the need for separate dedicated isolation structures, reducing area while maintaining manufacturing ease.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS9780200B2Semiconductor arrangement for a FinFET and method for manufacturing the same
Publication Date: 2017.10.03 INST OF MICROELECTRONICS CHINESE ACAD OF SCI LTD
  • US9780200B2 patent drawing
  • US9780200B2 patent drawing
  • US9780200B2 patent drawing

AI summary

A semiconductor arrangement and a method for manufacturing the same. An arrangement may include a bulk semiconductor substrate; a fin formed on the substrate; a first FinFET and a second FinFET formed on the substrate. The first FinFET comprises a first gate stack intersecting the fin and a first gate spacer disposed on sidewalls of the first gate stack. The second FinFET includes a second gate stack intersecting the fin and a second gate spacer disposed on sidewalls of the second gate stack; a dummy gate spacer formed between the first FinFET and the second FinFET and intersecting the fin; an isolation section self-aligned to a space defined by the dummy gate spacer. The isolation section electrically isolates the first FinFET from the second FinFET; and an insulation layer disposed under and abutting the isolation section.