FinFET Metal Gate WFM Tuning for Threshold Voltage Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In the semiconductor industry, manufacturing self-aligned contact structures over source/drain regions in nanometer technology process nodes poses challenges due to the complexity of three-dimensional designs and the need for precise control of threshold voltages in Fin FETs and metal gate structures.
Innovation Solution
A method involving the sequential fabrication of fin structures, dummy gate formation, recessing, and metal gate structure creation, with the use of work function adjustment layers (WFM) to adjust threshold voltages by varying their thickness and materials, allowing for precise control of threshold voltages across different transistors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If work function adjustment layers with varying thickness and materials are used to adjust threshold voltages, then threshold voltage control precision is improved, but device structure complexity increases
Solution Approach 1:
The patent applies local quality by using different work function adjustment layer configurations for different transistor types. Specifically, first-type-channel transistors receive a first work function adjustment layer while second-type-channel transistors receive a second work function adjustment layer with different material composition or thickness. This localized differentiation enables precise threshold voltage control for each transistor type without unnecessarily complicating the entire device structure, as each region receives only the specific treatment it requires.
2Manufacturing precision
If multiple etching steps are performed to form self-aligned contact structures, then manufacturing precision is improved, but etching damage increases
Solution Approach 1:
The patent applies preliminary action by forming a protective layer on the gate structure before performing etching operations to create self-aligned contact structures. This protective layer is deposited in advance to shield the gate from etching damage, and is subsequently removed after the etching is complete. This preliminary protective measure enables the necessary multiple etching steps to achieve high precision self-aligned contact structures while minimizing harmful etching damage to the gate, as the gate is protected during the etching process.
Data Source
AI summary
A semiconductor device includes first-type-channel field effect transistors (FETs) including a first first-type-channel FET including a first gate structure and a second first-type-channel FET including a second gate structure. The first first-type-channel FET has a smaller threshold voltage than the second first-type-channel FET. The first gate structure includes a first work function adjustment material (WFM) layer and the second gate structure includes a second WFM layer. At least one of thickness and material of the first and second WFM layers is different from each other.


