FinFET Channel With Gradient Germanium Concentration

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Solution Overview

Problem

Existing FinFET devices face challenges in achieving optimal performance due to limitations in channel region material composition and stress distribution, which affect carrier speed and threshold voltage stability.

Innovation Solution

A FinFET device structure is developed with a first material layer having a gradient germanium concentration for increased carrier speed and a second portion with a constant germanium concentration to improve threshold voltage stability, formed using chemical vapor deposition and etching processes to minimize defects and lattice mismatch.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a uniform germanium concentration is used in the channel region, then the manufacturing process is simple, but the carrier speed and threshold voltage stability are insufficient

Engineering Contradiction:
Improvecarrier speedVSAvoidmaterial composition complexity
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The channel region is divided into multiple portions with different germanium concentrations. Specifically, the channel includes a first portion with a first germanium concentration and a second portion with a second germanium concentration that is higher than the first. This local variation in material composition optimizes carrier speed in different regions while managing threshold voltage characteristics, resolving the contradiction between performance and simplicity.

Inventive Principle:
Principle #3Local quality

2Speed

If the germanium concentration is increased to improve carrier mobility, then carrier speed increases, but threshold voltage stability deteriorates

Engineering Contradiction:
Improvecarrier mobilityVSAvoidthreshold voltage stability
Core Design Contradiction:
SpeedVSStability of the object's composition

Solution Approach 1:

Different portions of the channel are assigned different germanium concentrations to balance carrier mobility and threshold voltage stability. The first portion has a lower germanium concentration to maintain threshold voltage stability, while the second portion has a higher germanium concentration to enhance carrier mobility. This spatial differentiation resolves the contradiction between speed and stability.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The germanium concentration parameter is varied across the channel region rather than maintaining a uniform value. By changing the concentration parameter from the first portion to the second portion, the patent achieves both improved carrier mobility in the high-concentration region and maintained threshold voltage stability in the low-concentration region, resolving the contradiction between these two performance metrics.

Inventive Principle:
Principle #35Parameter changes

3Speed

If a higher germanium concentration is used throughout the channel, then carrier mobility improves, but defects and lattice mismatch increase

Engineering Contradiction:
Improvecarrier mobilityVSAvoiddefect density
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The channel structure implements local quality variation by having a first portion with lower germanium concentration and a second portion with higher germanium concentration. This gradual transition and localized high-concentration region provide the carrier mobility benefits of high germanium content while limiting the overall defect density and lattice mismatch that would occur if the entire channel had uniformly high germanium concentration, thus resolving the contradiction between speed and reliability.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The approach enhances carrier mobility and stability of the threshold voltage, reducing defects and maintaining the integrity of fin structures, thereby improving the overall performance of FinFET devices.

Implementation Method 1

formed using chemical vapor deposition and etching processes

Methodology Applied
Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Data Source

PatentUS10879240B2Fin field effect transistor (FinFET) device structure
Publication Date: 2020.12.29 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US10879240B2 patent drawing
  • US10879240B2 patent drawing
  • US10879240B2 patent drawing

AI summary

A fin field effect transistor (FinFET) device structure and method for forming the same are provided. The FinFET device structure includes a fin structure extending above a substrate. The fin structure includes a channel region, a portion of the channel region is made of silicon germanium (SiGe), and the silicon germanium (SiGe) has a gradient germanium (Ge) concentration. The FinFET device structure includes a gate structure formed on the channel region of the fin structure.