Finger Biometric Sensor Direct Bonding Interface
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Solution Overview
Problem
Fingerprint sensors integrated into electronic devices often require separate authentication steps, which can be inconvenient and slow, especially in portable devices where simultaneous task performance is desired.
Innovation Solution
A finger biometric sensor assembly with a direct bonding interface between the sensor IC die and a cover layer, utilizing hydrophilic or hydrophobic bonding materials like silicon oxynitride, which reduces thickness and eliminates the need for glue layers, allowing for a more compact and efficient fingerprint sensing solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a traditional fingerprint sensor assembly with glue layers is used, then the assembly provides structural bonding between the sensor IC die and cover layer, but the overall thickness increases and manufacturing complexity increases
Solution Approach 1:
The patent removes the intermediate glue layer from the sensor assembly structure, directly bonding the sensor IC die to the cover layer. This extraction of the unnecessary intermediate layer reduces the overall thickness and simplifies the assembly structure while maintaining structural integrity through direct bonding.
Solution Approach 2:
The patent merges the bonding function previously performed by separate glue layers directly into the interface between the sensor IC die and cover layer. By eliminating the intermediate bonding material and creating a direct bond, the structure is simplified and thickness is reduced while maintaining the necessary adhesive and structural functions.
2Ease of operation
If separate authentication steps are required for fingerprint verification, then authentication can be performed, but the user experience deteriorates and time consumption increases
Solution Approach 1:
The patent integrates the fingerprint sensor directly into the device housing or display structure, merging the authentication function with the device's existing form factor. This integration allows authentication to occur seamlessly during normal device interaction rather than requiring separate authentication steps, improving user convenience and reducing time loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The direct bonding interface reduces the overall thickness of the sensor assembly, enhancing reliability and data quality while enabling faster authentication without compromising on size or performance, particularly beneficial for smaller electronic devices.
Implementation Method 1
The direct bonding interface may be a hydrophilic direct bonding interface
Implementation Method 2
Alternatively, the direct bonding interface may be a hydrophobic direct bonding interface
Implementation Method 3
The direct bonding interface may include silicon oxynitride
Implementation Method 4
The direct bonding interface may include silicon oxide
Data Source
AI summary
A finger biometric sensor assembly may include a finger biometric sensor integrated circuit (IC) die having a finger sensing area and a cover layer aligned with the finger sensing area. The finger biometric sensor may also include a direct bonding interface between the finger biometric sensor and the cover layer.