Finger Feature Module with Eccentric Through-Hole Circuit Stacking

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Solution Overview

Problem

The design of finger feature modules for electronic devices faces challenges in integrating keyswitch functionality with complex structural requirements, particularly due to issues with component peeling and difficulty in stacking circuit boards, which affects manufacturability and light uniformity.

Innovation Solution

The finger feature module incorporates a light guide seat with an eccentrically disposed through hole, allowing for the arrangement of circuit boards in an upper and lower room, and uses a flexible printed circuit board to connect multiple circuit boards, reducing the risk of component peeling and enhancing manufacturability and light uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the light guide seat is designed with a centrally disposed through hole, then the structural symmetry is maintained, but the circuit board stacking becomes difficult and components are prone to peeling

Engineering Contradiction:
Improvecircuit board stackingVSAvoidcomponent peeling resistance
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The patent applies asymmetry by positioning the through hole off-center in the light guide seat. This asymmetric placement allows the circuit board to be stacked in layers (first circuit board above the plate body, second circuit board below the plate body) with the through hole providing access for connection while avoiding the peeling issues associated with central placement. The asymmetric design optimizes both manufacturability and structural stability.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent utilizes the vertical dimension by stacking circuit boards at different heights relative to the light guide seat. The first circuit board is positioned above the plate body while the second circuit board is positioned below the plate body, creating a multi-layer vertical arrangement. This dimensional approach allows efficient space utilization and reduces component peeling by distributing components across different vertical levels.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If the light guide seat is designed as a single integrated part, then the structural integrity is maintained, but the arrangement flexibility of circuit boards is reduced

Engineering Contradiction:
Improvecircuit board arrangement flexibilityVSAvoidstructural integrity
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The light guide seat is segmented into multiple functional parts: a frame structure, a plate body with through hole, and illuminant receiving portions. This segmentation allows the circuit boards to be arranged flexibly in different positions (above and below the plate body) while each segment maintains its structural integrity. The modular design enables independent optimization of each component.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The plate body serves multiple functions: it provides structural support, creates the through hole for circuit board connection, and divides the internal space into upper and lower regions for flexible circuit board arrangement. The frame structure simultaneously provides structural integrity and accommodates the plate body and circuit boards. This multi-functionality increases adaptability without compromising strength.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250265866A1Finger feature module
Publication Date: 2025.08.21 DARFON ELECTRONICS CORP
  • US20250265866A1 patent drawing
  • US20250265866A1 patent drawing
  • US20250265866A1 patent drawing

AI summary

A finger feature module includes a light guide seat including a frame and a plate body disposed in the frame and having an eccentrically disposed through hole, a circuit board assembly having a first portion disposed in the frame and located above the plate body and a second portion passing through the through hole to be at least partially located below the plate body, a feature sensor on the first portion of the circuit board assembly, and a plurality of illuminants electrically connected to the circuit board assembly, wherein two of the illuminants are located at two opposite ends of the through hole, and a virtual connecting line of the two illuminants overlaps the through hole.