Fingerprint Button Assembly Without Steel Support in Electronic Housings
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Solution Overview
Problem
The existing assembly method for fingerprint modules in electronic devices requires a large space and increased costs due to the use of steel supports, which affects the device's strength and internal space utilization.
Innovation Solution
A novel assembly method for fingerprint modules using a first and second housing with a button that includes a functional module component, button piece, and button pad, where the button pad is assembled with the second housing through an assembly portion, eliminating the need for a steel support and optimizing internal space and strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a plastic or stainless steel support is used to fix the fingerprint module on the lower housing, then the fingerprint module can be assembled, but the entire fingerprint module occupies a large space and more glue is reduced for the upper housing, affecting the strength of the entire device
Solution Approach 1:
The patent removes the steel support component from the assembly structure. Instead of using a separate steel support to fix the fingerprint module, the solution integrates the fixing function directly into the housing structure through precision fitting and bonding, eliminating the need for the steel support and thereby preserving glue for strengthening the upper housing
Solution Approach 2:
The patent merges the support and fixing functions into the housing structure itself. The lower housing incorporates positioning structures and bonding surfaces that directly support the fingerprint module, combining the structural support role with the housing rather than requiring a separate steel support component
2Ease of manufacture
If a plastic or stainless steel support is used to fix the fingerprint module, then the module can be fixed, but the fingerprint module occupies a large space of the electronic device
Solution Approach 1:
The steel support component is extracted and removed from the assembly. The fingerprint module is directly mounted to the lower housing using integrated positioning structures and bonding, eliminating the space that would be occupied by a separate steel support structure
Solution Approach 2:
The fingerprint module is nested directly into the housing structure with precision positioning features built into the housing. The module fits tightly within the allocated space without requiring additional steel support structures, achieving compact integration
3Volume of stationary object
If more glue is reduced for the upper housing to avoid empty space, then space utilization improves, but the strength of the entire device is greatly affected
Solution Approach 1:
By removing the steel support, the patent eliminates the space that would be wasted and the glue that would be consumed in assembling the support structure. This allows more glue to be allocated to the upper housing for strength enhancement while maintaining efficient space utilization
Solution Approach 2:
The patent discards the steel support component and recovers the glue that would have been used to assemble it. This recovered glue is then applied to the upper housing to enhance device strength, transforming a structural component into bonding material for strength enhancement
Data Source
AI summary
An electronic device includes a first housing, a second housing, and a first button. The first button includes a functional module component, a functional module FPC, a button piece, a button pad, and a button FPC. In an accommodating space, the button FPC, the button pad, the button piece, and the functional module component are sequentially arranged from inside to outside. The functional module component is electrically connected to the functional module FPC. The functional module component and the button pad are fixed on the button piece. An assembly portion is disposed on the button pad, and the button pad is assembled with the second housing through the assembly portion.