Fingerprint Chip Package Recessed Portion Positioning

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Solution Overview

Problem

The existing fingerprint chip package structures face challenges in efficient positioning and mounting within decoration rings, leading to low assembling efficiency.

Innovation Solution

A fingerprint chip package structure with a package body featuring a recessed portion at the junction of its bottom and lateral surfaces, which includes a support rim for positioning and mounting within a decoration enclosure, enhancing assembly efficiency and allowing for miniaturization of the terminal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the fingerprint chip package structure uses a conventional flat package body design, then the structure is simple to manufacture, but the positioning accuracy and mounting efficiency in the decoration ring are poor

Engineering Contradiction:
Improvepositioning accuracyVSAvoidpackage body structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The package body incorporates a recessed portion at specific locations (junction of bottom and lateral surfaces) to provide positioning functionality, while the rest of the structure remains simple. This localized structural modification achieves accurate positioning in the decoration ring without requiring complex overall design

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The package body is divided into distinct functional regions: a bottom surface for mounting, lateral surfaces for structural support, and a recessed portion for precise positioning. This segmentation allows each part to fulfill its specific function efficiently, improving both positioning accuracy and manufacturing simplicity

Inventive Principle:
Principle #1Segmentation

2Reliability

If the fingerprint chip package structure uses a larger size to ensure proper fitting, then the mounting stability is improved, but the terminal thickness cannot be reduced for miniaturization

Engineering Contradiction:
Improvemounting stabilityVSAvoidpackage thickness
Core Design Contradiction:
ReliabilityVSLength of moving object

Solution Approach 1:

The fingerprint chip is nested within the package body, and the package body is designed to nest within the decoration ring with precise dimensional matching. The recessed portion allows the package to fit snugly into the decoration ring's mounting cavity, providing stable mounting while minimizing the overall thickness required

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

Instead of increasing package size in all dimensions for stability, the design utilizes the vertical dimension effectively with the recessed portion engaging with the decoration ring's mounting structure. This dimensional optimization achieves mounting stability while keeping the package thin for terminal miniaturization

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Productivity

If the fingerprint chip package structure lacks a recessed portion, then the structure is simpler, but the assembling efficiency in the decoration ring is low

Engineering Contradiction:
Improveassembling efficiencyVSAvoidpackage body structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The recessed portion is pre-formed in the package body during manufacturing, creating a built-in positioning feature that guides the package into correct alignment with the decoration ring during assembly. This preliminary structural preparation enables rapid and accurate assembly without requiring additional positioning operations

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The recessed portion acts as an intermediary feature that mediates between the package body and the decoration ring's mounting structure. It provides a mechanical interface that facilitates easy positioning and mounting, significantly improving assembling efficiency without adding complex external components

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS10565426B2Fingerprint chip package structure, input assembly and terminal
Publication Date: 2020.02.18 GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD
  • US10565426B2 patent drawing
  • US10565426B2 patent drawing
  • US10565426B2 patent drawing

AI summary

The present disclosure provides a fingerprint chip package structure, an input assembly and a terminal. The fingerprint chip package structure includes a package body and a fingerprint identification chip. The package body includes a bottom surface and a lateral surface connected to the bottom surface, and defines a recessed portion at a junction of the bottom surface and the lateral surface. The fingerprint identification chip is received in the package body.