Fingerprint Light Guide Mechanism with Integrated Frame and Electroplated Contacts
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Solution Overview
Problem
Conventional fingerprint recognition devices are bulky, costly, and complex to manufacture due to the integration of light emitting diodes and image capturing devices on a circuit board, making them difficult to integrate into thin and portable electronic devices while providing sufficient brightness and contrast for fingerprint collection.
Innovation Solution
A light guide mechanism for a fingerprint recognition plate comprising a frame with a hollow portion, multiple light emitting diodes, and a light guide plate, formed using injection molding and electroplating processes, allowing for compact integration and efficient assembly, with the light emitting diodes mounted using surface mount technology to transmit light rays effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If light emitting diodes and image capturing devices are integrated on a circuit board, then the fingerprint recognition device can be assembled, but the volume becomes large and the device becomes bulky
Solution Approach 1:
The patent merges the light guide plate and frame into a single integrated component formed by injection molding. This combination eliminates the need for separate assembly of these parts and allows the light emitting diodes to be directly mounted on the integrated structure, reducing overall device volume while maintaining assembly capability
Solution Approach 2:
The light guide plate is designed to serve multiple functions: it guides light from the light emitting diodes, provides structural support, and houses the image capturing device. This multi-functionality reduces the number of separate components needed, thereby reducing device volume while maintaining ease of manufacture
2Ease of manufacture
If light emitting diodes and image capturing devices are integrated on a circuit board, then the fingerprint recognition device can be assembled, but the manufacturing process becomes complex and cost increases
Solution Approach 1:
The frame and light guide plate are merged into a single component formed through injection molding, reducing the number of manufacturing steps. The electroplating process is integrated into the molding process to create conductive portions, further simplifying the manufacturing process and reducing complexity
Solution Approach 2:
The injection molding process automatically creates the hollow portion and integrates the light guide plate and frame structures, eliminating the need for separate machining or assembly operations. This self-forming capability reduces manufacturing complexity and cost
3Ease of manufacture
If a conventional integrated structure is used, then the fingerprint recognition device can be assembled, but the device cannot be made thin and portable
Solution Approach 1:
The image capturing device is positioned within the hollow portion of the integrated frame structure, and the light emitting diodes are mounted on the frame's surface. This nested arrangement allows components to be space-efficiently organized, enabling the device to be made thin while maintaining assembly capability
Solution Approach 2:
The light emitting diodes are arranged around the hollow portion in a three-dimensional configuration rather than in a flat plane, allowing for compact integration that reduces device thickness while maintaining all necessary functional elements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a thin and compact fingerprint recognition system that reduces manufacturing complexity and cost, allowing for efficient assembly and effective fingerprint image capture with sufficient brightness and contrast, enhancing the portability and security of electronic devices.
Implementation Method 1
A plurality of light emitting diodes are mounted on electric conductive portions of the frame by a surface mount technology (SMT) process. Light rays emitted by the light emitting diodes can be transmitted in the light guide plate.
Implementation Method 2
forming electric conductive portions in the patterns of the frame in a manner of electroplating or electroless plating. In this manner, the frame is formed with electric conductive circuit.
Data Source
AI summary
A light guide mechanism of a fingerprint recognition plate includes a frame, a light guide plate, first electrodes, second electrodes and light emitting diodes. The frame has a hollow portion and receiving troughs. Each of the receiving troughs forms a first through hole and a second through hole penetrating the frame. The light guide plate covers the hollow portion. The first electrodes are in the first through holes, and the second electrodes are in the second through holes. Each of the light emitting diodes is in the receiving trough and includes a first electrode pin and a second electrode pin. The first electrode pin pierces the first through hole to be connected to the first electrode. The second electrode pin pierces through the second through hole to be connected to the second electrode. The first electrode pin and second electrode pin are exposed from the bottom of the frame.