Fingerprint Module Thickness Reduction via Embedded Cavity Design
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Solution Overview
Problem
The thickness of fingerprint modules in electronic devices, such as mobile phones, cannot be reduced sufficiently, hindering the miniaturization of these devices.
Innovation Solution
The design incorporates an encapsulation layer with a recessed end surface and a decoration component with an embedded cavity, allowing the circuit board assembly to be partially received within the cavity, reducing the overall thickness of the fingerprint module by using a stepped surface engagement mechanism, which also ensures reliable electrical connection and protection from corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of each component in the fingerprint module is reduced, then the thickness of the electronic apparatus can be reduced, but the structural integrity and electrical connection reliability may deteriorate
Solution Approach 1:
The circuit board assembly is partially received within the embedded cavity of the decoration component, creating a nested structure where one component is embedded within another. This nesting approach reduces the overall thickness of the fingerprint module while maintaining the structural integrity and electrical connection reliability through the integrated cavity design.
Solution Approach 2:
The design transitions from a conventional planar arrangement to a three-dimensional stepped surface engagement mechanism. The circuit board assembly extends from the first surface of the decoration component into the embedded cavity, utilizing vertical space to reduce thickness while maintaining connection reliability through multi-level engagement surfaces.
2Length of moving object
If the thickness of each component in the fingerprint module is reduced, then the thickness of the electronic apparatus can be reduced, but the protection from corrosion and static electricity interference may deteriorate
Solution Approach 1:
The encapsulation layer encapsulates the circuit board assembly, creating a protective nested structure. This encapsulation provides corrosion protection and static electricity shielding while the overall module thickness is reduced through the embedded cavity design that integrates the circuit board into the decoration component.
Solution Approach 2:
The fingerprint module employs composite material structures where the encapsulation layer, decoration component, and circuit board assembly are integrated into a unified composite structure. This composite design provides both protection against harmful factors and thickness reduction through optimized material layering and embedding.
3Length of moving object
If a stepped surface engagement mechanism is used to reduce thickness, then the overall thickness is reduced, but the manufacturing complexity may increase
Solution Approach 1:
The design merges the decoration component and circuit board assembly into a single integrated unit where the circuit board is partially embedded within the decoration component's cavity. This merging eliminates the need for separate mounting structures and simplifies the manufacturing process while achieving thickness reduction through the integrated stepped surface engagement.
Solution Approach 2:
The decoration component serves multiple functions: it provides aesthetic decoration, structural support, and houses the embedded cavity for the circuit board assembly. This multi-functionality reduces the need for additional components and simplifies manufacturing while achieving the thickness reduction goal through the integrated design.
Data Source
AI summary
A fingerprint module and a mobile terminal are described. The fingerprint module may include: an encapsulation layer and a decoration component. The encapsulation layer may be configured to encapsulate a fingerprint identifying assembly and include a rear wall having a first mating portion. The decoration component may define an embedded groove and include a second mating portion in the embedded groove. The encapsulation layer may be embedded in the embedded groove, and the first mating portion may be embedded to the second mating portion.