Fingerprint Module Color Filter Coating Thickness Reduction
Solution Overview
Problem
The thickness of conventional optical fingerprint identification modules is increased due to the structural thickness of the color filter, limiting the space design of electronic devices.
Innovation Solution
A fingerprint identification module with a color filter coating applied directly onto the glass substrate of the screen assembly, where the optical collimator and image sensor are encapsulated separately, eliminating the need for a separate color filter structure within the module, thus reducing the overall thickness and enhancing light interference resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a separate color filter structure is used for infrared filtration, then infrared light interference is prevented, but the structural thickness of the fingerprint identification module increases
Solution Approach 1:
The patent combines the color filter with the glass substrate to form an integrated structure. The color filter is directly formed on the glass substrate through coating processes, eliminating the need for a separate color filter component and reducing the overall structural thickness while maintaining infrared filtration capability
Solution Approach 2:
The patent uses thin film coating technology to create the color filter layer on the glass substrate. This thin film approach replaces traditional thick separate color filter components, achieving both infrared filtration and reduced thickness requirements
2Object-affected harmful factors
If the color filter is arranged above the fingerprint identification module, then infrared filtration is achieved, but the space design of the electronic device is constrained
Solution Approach 1:
The color filter is merged with the glass substrate to form a single integrated component. This integration eliminates the need for additional space above the fingerprint identification module, providing greater flexibility in electronic device space design while maintaining effective infrared filtration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the structural thickness of the fingerprint identification module, freeing up design space in electronic devices while effectively preventing infrared light interference, thereby improving the module's resistance to intensive light.
Implementation Method 1
the color filter has a thickness of about 0.11mm, resulting in a constraint to a space design of the electronic device to some extent... perform infrared filtration through the IR color filter 1012, so as to prevent the infrared light from interfering with the image sensor 1015
Implementation Method 2
light beams are transmitted by a transmitting unit toward a finger, and an energy difference is sensed by an under-display receiving unit because different energy levels of the light beams are absorbed and reflected by ridges and valleys of a fingerprint
Implementation Method 3
an energy difference is sensed by an under-display receiving unit because different energy levels of the light beams are absorbed and reflected by ridges and valleys of a fingerprint, so as to generate fringes with different brightness values, i.e., fingerprint image information
Data Source
Figure 1~2
Figure 3
AI summary
A fingerprint identification module and an electronic device are provided. The electronic device includes a screen assembly provided with a glass substrate. The fingerprint identification module includes: a color filter coating applied onto the glass substrate; an optical collimator arranged at a side of the color filter coating away from the glass substrate; and an image sensor arranged at a side of the optical collimator away from the color filter coating.