Under-screen Fingerprint Module Structure with Dielectric Separation
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Solution Overview
Problem
The existing module structure for under-screen fingerprint identification devices suffers from high loss costs during testing due to the inability to decouple the sensing module and the display unit, leading to unnecessary discarding of the entire module when either component is damaged.
Innovation Solution
A module structure is designed with a middle frame, a sensing module, a display unit, and dielectric layers to create a detachable and quasi-fixed connection between the components, allowing for separation and reuse of undamaged units, and includes a strengthening layer for enhanced reliability and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sensing module and display unit are directly attached to form a fixed module structure, then the structural stability and reliability are improved, but the loss cost during testing increases because the entire module must be discarded when either component is damaged
Solution Approach 1:
The module structure is segmented into separable components: the sensing module and the display unit are connected through a detachable connection mechanism involving dielectric layers, allowing independent separation and reuse of undamaged components while maintaining structural integrity during operation
Solution Approach 2:
The connection between the sensing module and display unit transitions from a static fixed state to a dynamic state where the connection strength can be adjusted or reversed through preset treatments (temperature, light, or solvent treatments), enabling the structure to be fixed during operation but separable during testing or maintenance
2Device complexity
If the sensing module and display unit are directly attached, then the device complexity is reduced, but the stress and pressure on individual components increase leading to potential damage
Solution Approach 1:
Dielectric layers are introduced as intermediary elements between the sensing module and display unit, providing a buffer that reduces direct stress and pressure transmission while maintaining the necessary electrical insulation and mechanical connection
Solution Approach 2:
The dielectric layers function as flexible thin films that can deform to absorb and distribute mechanical stress, protecting the underlying components from direct pressure while maintaining the overall structural integrity
3Loss of substance
If a detachable connection is implemented using dielectric layers, then the loss cost is reduced by enabling component separation, but the manufacturing process complexity increases
Solution Approach 1:
The connection properties of the dielectric layers are controlled through parameter changes in the manufacturing process, such as applying specific temperature, light, or solvent treatments that modify the adhesive strength to achieve the desired detachable connection with controlled connection and separation capabilities
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the cost loss by enabling the separation of damaged components, improves the reliability of the module by reducing direct pressure and stress, and ensures high-quality fingerprint and display images through controlled connections and deformable materials.
Implementation Method 1
a first dielectric layer filled between the sensing module and the display unit... the first dielectric layer is configured to realize a detachable connection between the sensing module and the display unit
Implementation Method 2
the second dielectric layer is made of a deformable material... another side of the second dielectric layer is in contact with the bottom of the groove
Implementation Method 3
the third dielectric layer is made of a deformable material... disposed between the first surface of the middle frame and the display unit
Data Source
AI summary
The present disclosure provides a module structure, including: a middle frame having a first surface, wherein a groove is disposed in the middle frame and has an opening on the first surface; a sensing module, wherein at least a partial of the sensing module is disposed in the groove; a display unit, disposed on the first surface of the middle frame and the sensing module; a first dielectric layer disposed between the sensing module and the display unit; a second dielectric layer disposed between the sensing module and a bottom of the groove; and a third dielectric layer disposed between the first surface of the middle frame and the display unit. With the first dielectric layer, when any one of the sensing module or the display unit is damaged in a testing process, the other one can be recovered, thereby reducing the cost and loss.