Fingerprint Recognition Module Stacked Dielectric Layers
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Solution Overview
Problem
Traditional fingerprint recognition modules require complex semiconductor technologies, leading to high manufacturing costs and reduced product yield, and are difficult to integrate into small or thin electronic devices due to their size and volume constraints.
Innovation Solution
A fingerprint recognition module design that directly assembles sensing film layers and a processing unit on an adaptor board, allowing the processing unit and fingerprint recognition region to be located on two sides of the module, reducing dimensions and improving assembly yield, with a stacked structure of dielectric layers and sensing strings connected via conducting pillars and contact points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sensing film layers are fabricated on glass or semiconductor substrates with cables and circuit boards, then the module has complete functionality, but the manufacturing cost increases and product yield decreases
Solution Approach 1:
The patent merges the sensing film layers and processing unit into a single integrated module. The sensing film layers are directly mounted on the processing unit without requiring separate glass substrates, cables, and circuit boards. This integration eliminates multiple assembly steps and reduces manufacturing complexity, thereby increasing product yield and reducing manufacturing costs while maintaining complete functionality.
Solution Approach 2:
The patent extracts and eliminates unnecessary components from the traditional fingerprint recognition module structure. Specifically, it removes the glass substrate, cables, and separate circuit board, keeping only the essential sensing film layers and processing unit. This extraction simplifies the manufacturing process and reduces assembly complexity, leading to improved product yield and reduced costs.
2Adaptability or versatility
If traditional assembly with substrates, cables and circuit board is used, then the module has complete functionality, but the volume increases making it difficult to apply to small or thin electronic devices
Solution Approach 1:
The patent combines the sensing film layers and processing unit into a compact integrated structure. By eliminating the glass substrate, cables, and separate circuit board, the module volume is dramatically reduced. This integrated design maintains complete functionality while making the module suitable for application in small or thin electronic devices where space is constrained.
Solution Approach 2:
The patent transitions from a three-dimensional assembly with separate components (substrate, cables, circuit board) to a planar integrated structure. The sensing film layers are directly mounted on the processing unit in a two-dimensional configuration, reducing the overall volume and enabling application in thin electronic devices while maintaining all necessary functions.
3Volume of stationary object
If sensing film layers and processing unit are assembled on opposite sides, then the module dimensions are reduced, but the assembly complexity increases
Solution Approach 1:
The patent segments the module into two functional sides: one side for the sensing film layers and the other side for the processing unit. This segmentation allows each side to be optimized independently while maintaining compact overall dimensions. The sensing film layers are mounted on the processing unit in a structured arrangement that reduces assembly complexity despite the dual-sided configuration.
Data Source
AI summary
The invention provides a fingerprint recognition module comprising a first dielectric layer, a processing unit, a plurality of first sensing series and a plurality of second sensing series. A first side and a second side of the first dielectric layer are provided with first metal contacts and second metal contacts respectively. The processing unit, disposed on the first side, has first conductive pads for electrically connecting the first metal contacts, coupled with the second metal contacts. The first sensing series, coupled with the first traces, are arranged between the first dielectric layer and a second dielectric layer. The second sensing series, coupled with the second traces, are arranged between the second dielectric layer and a third dielectric layer. The first trace is coupled with a third trace through a first conductive pillar, and the second traces and the third traces are coupled with the second metal contacts.