Fingerprint Recognition Module with Dual-Side Substrate Integration
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Solution Overview
Problem
Traditional fingerprint recognition modules require complex semiconductor technologies, leading to high manufacturing costs and reduced yield, and are not suitable for small or thin electronic devices due to their size and volume constraints.
Innovation Solution
A fingerprint recognition module design that directly assembles sensing film layers and a processing unit on an adaptor board, allowing the processing unit and fingerprint recognition region to be located on both sides of the module, reducing dimensions and improving assembly yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional sensing film layers are fabricated on glass or semiconductor substrates with cables and circuit boards, then the module has sufficient space for components, but the manufacturing cost increases and assembly yield decreases
Solution Approach 1:
The patent merges the sensing film layers and processing unit onto a single substrate, eliminating the need for separate cables and circuit boards. This integration reduces the number of assembly steps and components, thereby lowering manufacturing cost and improving assembly yield while maintaining sufficient space for all functional elements.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it acts as the mechanical support structure, the electrical connection medium (replacing cables), and the mounting platform for both sensing film layers and processing unit. This multi-functionality reduces component count and simplifies the overall assembly process.
2Adaptability or versatility
If traditional substrate, cables and circuit board are used, then all components can be accommodated, but the overall volume increases making it unsuitable for small or thin electronic devices
Solution Approach 1:
By merging the sensing film layers and processing unit onto a single substrate and eliminating cables and separate circuit boards, the overall module volume is significantly reduced. This integration allows the fingerprint recognition module to be compact enough for small or thin electronic devices while maintaining all necessary functional components.
Solution Approach 2:
The patent arranges components in a planar configuration on the substrate surface, utilizing two-dimensional space efficiently. The sensing film layers and processing unit are positioned on opposite sides of the substrate, optimizing spatial utilization and minimizing the module's thickness and overall volume.
3Ease of operation
If sensing film layers and processing unit are assembled separately with cables, then connection is achieved, but the assembly process becomes complex and time-consuming
Solution Approach 1:
The patent combines the sensing film layers and processing unit into a single integrated assembly on one substrate, eliminating the need for separate cable connections and multiple assembly steps. This simplifies the assembly process and significantly reduces assembly time while ensuring reliable electrical connections between components.
Data Source
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AI summary
The invention provides a fingerprint recognition module comprising a first dielectric layer, a processing unit, a plurality of first sensing series and a plurality of second sensing series. A first side and a second side of the first dielectric layer are provided with first metal contacts and second metal contacts respectively. The processing unit, disposed on the first side, has first conductive pads for electrically connecting the first metal contacts, coupled with the second metal contacts. The first sensing series, coupled with the first traces, are arranged between the first dielectric layer and a second dielectric layer. The second sensing series, coupled with the second traces, are arranged between the second dielectric layer and a third dielectric layer. The first trace is coupled with a third trace through a first conductive pillar, and the second traces and the third traces are coupled with the second metal contacts.