Fingerprint Module Packing via Vacuum Adsorption
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Solution Overview
Problem
The conventional packing process of fingerprint identification modules is labor-intensive and time-consuming, requiring successive removal and placement on a packing plate, which increases labor and time costs.
Innovation Solution
A method involving a supporting plate with an adhesive layer and frame, vacuum adsorption fixture, and a welding protection layer to simultaneously attach, fix, and transfer multiple fingerprint identification modules to a packing plate, reducing manual handling and enabling efficient assembly and welding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If fingerprint identification modules are successively removed and placed on a packing plate, then each module can be individually handled, but the packing process becomes labor-intensive and time-consuming
Solution Approach 1:
Multiple fingerprint identification modules are simultaneously attached to a supporting plate and transferred together as a group using a vacuum adsorption fixture, merging multiple individual operations into a single collective operation that maintains ease of handling while dramatically increasing packing speed
2Productivity
If multiple fingerprint identification modules are packed simultaneously, then packing efficiency increases, but the device complexity increases
Solution Approach 1:
A supporting plate serves as an intermediary carrier that holds multiple modules in a fixed arrangement, and a vacuum adsorption fixture acts as a mediator to transfer the entire group from the supporting plate to the packing plate, simplifying the complex task of simultaneous multi-module handling into two straightforward steps
3Manufacturing precision
If manual successive placement is used, then placement accuracy can be ensured, but labor cost increases
Solution Approach 1:
Multiple fingerprint identification modules are pre-attached to the supporting plate in their correct positions before the transfer operation, ensuring placement accuracy is established in advance. The vacuum adsorption fixture then simply transfers the pre-positioned modules as a group, eliminating the need for repeated manual placement operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces labor and time costs by enabling simultaneous packing and transfer of multiple modules, improving the efficiency of the packing process while ensuring accurate placement and connection of components.
Implementation Method 1
the vacuum adsorption holes generate a vacuum adsorption force to fix the plural fingerprint identification modules in the vacuum adsorption holes
Data Source
AI summary
A fingerprint identification module packing method is provided. Firstly, plural fingerprint identification modules are attached on a supporting plate. Then, plural covering plates are attached on fingerprint sensing chips of the fingerprint identification modules. Then, the fingerprint identification modules are transferred to vacuum adsorption holes of a vacuum adsorption fixture. Then, the fingerprint sensing chips, the corresponding covering plates and corresponding metal terminals are welded by a laser welding process. Afterwards, the vacuum adsorption fixture is disabled. Consequently, the plural fingerprint identification modules are transferred to the packing plate.