Fingerprint Sensor Package Layout for Thin Smart Card Authentication
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Fingerprint sensor packages face challenges in achieving low cost, reduced size, and maintained reliability and sensitivity while preventing financial accidents due to theft or loss of smart cards.
Innovation Solution
A fingerprint sensor package design incorporating a first and second substrate, conductive wire, controller chip, and molding layer, with specific configurations of sensing patterns and bonding pads, and a smart card configuration that includes a card main body, security chip, and fingerprint sensor package for secure fingerprint recognition and authentication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the fingerprint sensor package size and thickness are reduced, then the product becomes more compact and cost-effective, but the reliability and sensitivity of fingerprint acquisition may deteriorate
Solution Approach 1:
The patent implements a nested structure where the second substrate containing sensing patterns is positioned on the second surface of the core insulating layer, with the molding layer nested around these components. This nested arrangement allows compact integration of multiple functional layers (substrates, sensing patterns, bonding pads, molding layer) in a small volume while maintaining their individual functions and electrical connections, thereby achieving size reduction without compromising sensing reliability
Solution Approach 2:
The patent transitions from a planar two-dimensional layout to a three-dimensional stacked configuration by placing the second substrate on the second surface of the core insulating layer, with the molding layer extending from the second substrate to cover bonding pads and isolate external connection pads. This vertical stacking in the third dimension enables compact integration while preserving electrical connectivity and sensing performance
2Volume of moving object
If the fingerprint sensor package size and thickness are reduced, then the product becomes more compact and cost-effective, but the sensitivity of fingerprint acquisition may deteriorate
Solution Approach 1:
The nested configuration allows the sensing patterns to be positioned optimally close to the fingerprint contact surface while maintaining adequate electrical connection paths. The molding layer is nested to provide protection without adding excessive thickness, enabling high sensitivity in a compact form factor
Solution Approach 2:
The patent applies different material properties and structural characteristics to different regions: the core insulating layer provides electrical isolation, the second substrate provides mechanical support and electrical connectivity for sensing patterns, and the molding layer provides environmental protection. This localized optimization of material properties maintains sensing sensitivity while reducing overall package size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the reliability and sensitivity of fingerprint recognition, reduces the overall thickness of the fingerprint sensor package and smart card, and prevents financial accidents by ensuring secure authentication and authorization.
Implementation Method 1
a plurality of first sensing patterns isolated from direct contact with each other in a first direction and extending in a second direction intersecting with the first direction, a plurality of second sensing patterns isolated from direct contact with each other in the second direction and extending in the first direction, and the plurality of first sensing patterns and the plurality of second sensing patterns may be isolated from direct contact with each other in a third direction perpendicular to the first and second directions, and the plurality of first sensing patterns and the plurality of second sensing patterns may collectively comprise a plurality of capacitors
Data Source
AI summary
A fingerprint sensor package includes a first substrate including a core insulating layer; a first bonding pad on the core insulating layer; and an external connection pad between an edge of the second surface of the core insulating layer and the first bonding pad, a second substrate on the core insulating layer, the second substrate including: a plurality of first sensing patterns spaced apart in a first direction and extending in a second direction intersecting with the first direction; a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction; and a second bonding pad, a conductive wire connecting the first bonding pad to the second bonding pad; a controller chip on the second substrate; and a molding layer covering the second substrate and the first bonding pad and spaced apart from the external connection pad.