Fingerprint Sensor Package Structure for Thin, Damage-Resistant Cards
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Solution Overview
Problem
Fingerprint sensor packages face challenges in maintaining reliability and sensitivity while being miniaturized and thinned, leading to potential damage from repeated use.
Innovation Solution
A fingerprint sensor package design featuring a first substrate with a core insulating layer and a second substrate with sensing patterns, connected by a conductive support and encapsulated in a molding layer, to enhance durability and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the fingerprint sensor package is miniaturized and thinned, then the size and height are reduced, but the reliability and damage resistance deteriorate
Solution Approach 1:
The patent employs a multi-layer composite structure consisting of a first substrate (support substrate), a second substrate (sensing substrate), a core insulating layer, a molding layer, and a conductive support. This composite architecture provides mechanical strength and damage resistance while maintaining a compact, thin form factor suitable for miniaturized fingerprint sensors.
Solution Approach 2:
The fingerprint sensor package is divided into functionally independent substrates: the first substrate provides mechanical support, the second substrate contains sensing patterns, and the core insulating layer provides electrical isolation. This segmentation allows each component to be optimized for its specific function while contributing to overall reliability without increasing total size.
2Volume of moving object
If the fingerprint sensor package is miniaturized and thinned, then the size and height are reduced, but the sensitivity of fingerprint acquisition deteriorates
Solution Approach 1:
The patent transitions from a single-plane sensing structure to a three-dimensional stacked architecture with sensing patterns arranged in multiple layers. The first and second substrates are positioned at different heights, with sensing patterns on each substrate contributing to fingerprint detection. This vertical arrangement enhances sensitivity by increasing the effective sensing volume without expanding the horizontal footprint, thus maintaining a thin profile.
3Duration of action of stationary object
If repeated use is increased, then the operational duration is extended, but the package becomes damaged due to reduced reliability
Solution Approach 1:
The conductive support structure and the core insulating layer serve as protective elements positioned beforehand to cushion and distribute mechanical stresses during repeated use. The molding layer encapsulates the sensing components, providing environmental protection and mechanical reinforcement that prevents damage accumulation over time, thereby extending operational duration while maintaining reliability.
Data Source
AI summary
A fingerprint sensor package includes: a first substrate including a core insulating layer including a first surface and a second surface and a through-hole, a first bonding pad on the second surface, and an external connection pad between an edge of the second surface and the first bonding pad; a second substrate in the through-hole and including a third surface and a fourth surface, and including first sensing patterns on the third surface, spaced apart in a first direction, and extending in a second direction, second sensing patterns spaced apart from each other in the second direction and extending in the first direction, and a second bonding pad on the fourth surface; a conductive support electrically connecting the first bonding pad and the second bonding pad and supporting the first substrate and the second substrate; a controller chip on the second substrate; and a molding layer on the second surface.