Fingerprint Module Manufacturing via Simultaneous Piezoelectric Layer Assembly

The patent merges the formation processes of the first and second piezoelectric layers into a single simultaneous manufacturing step. By forming both piezoelectric layers on opposite surfaces of the base at the same time rather than sequentially, the manufacturing process is significantly accelerated while maintaining the required precision of each individual layer.

The patent segments the manufacturing process into distinct stages: a first stage where both piezoelectric layers are formed simultaneously on the base, and a second stage where both layers are adhered simultaneously. This segmentation allows complex operations to be broken down into manageable, repeatable steps that can be automated and standardized, reducing overall process complexity despite the simultaneous operations.

The patent applies preliminary action by preparing both piezoelectric layers for adherence simultaneously before the actual bonding process. Transfer bases are prepared in advance with both layers positioned, and the adherence process is then executed in a single operation rather than requiring separate preparation and bonding steps for each layer individually.