Fingerprint Sensor Peelable Chip Unit Replacement
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Solution Overview
Problem
Current fingerprint sensors require the entire unit to be replaced when the chip unit needs updating, leading to increased costs due to the inability to detach and replace only the chip unit independently.
Innovation Solution
A fingerprint sensor design featuring a chip unit attached via a peelable adhesive layer, allowing for the chip unit to be detached and replaced without replacing the entire sensor, utilizing a substrate layer with different adhesive layers for separation and a support element to prevent chip unit breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the chip unit is permanently secured to the fingerprint sensor using strong adhesion, then the sensor structure is stable and reliable, but the chip unit cannot be replaced independently requiring replacement of the entire sensor
Solution Approach 1:
The fingerprint sensor is divided into separable components: the chip unit and the sensor substrate. The adhesive layer is segmented into a first adhesive layer (chip unit to substrate) and a second adhesive layer (substrate to housing), allowing the chip unit to be separated from the substrate for replacement while maintaining structural stability during operation.
Solution Approach 2:
The adhesive layer acts as an intermediary element between the chip unit and the sensor substrate. By controlling the adhesive properties and positioning, it enables both stable attachment during use and controlled separation for replacement, mediating between the conflicting requirements of reliability and repairability.
2Adaptability or versatility
If the entire fingerprint sensor is replaced when the chip unit needs updating, then the chip unit can be updated, but the cost increases significantly
Solution Approach 1:
By segmenting the fingerprint sensor into replaceable chip unit and reusable sensor substrate, the invention enables selective replacement of only the chip unit when updating is needed, rather than replacing the entire sensor assembly, thereby reducing material loss and replacement costs.
Solution Approach 2:
The sensor substrate, housing, and second adhesive layer are recovered and reused when the chip unit is replaced. Only the chip unit is discarded and replaced, maximizing resource utilization and minimizing replacement costs while maintaining adaptability for chip unit updates.
3Ease of repair
If the chip unit is made detachable from the fingerprint sensor, then the chip unit can be replaced independently, but the sensor structure becomes more complex
Solution Approach 1:
The detachable structure is achieved through simple segmentation using adhesive layers as separation interfaces. The first adhesive layer bonds the chip unit to the substrate, while the second adhesive layer bonds the substrate to the housing, creating a straightforward multi-layer structure that enables replacement without significant complexity increase.
Solution Approach 2:
The adhesive layers serve as intermediary elements that simplify the detachable design. Rather than requiring complex mechanical fastening or disassembly mechanisms, the adhesive intermediaries provide natural separation planes that enable easy chip unit replacement while maintaining structural integrity during operation.
Data Source
AI summary
A fingerprint sensor, a terminal, and a method for manufacturing a fingerprint sensor are provided. The fingerprint sensor includes a chip unit and a first adhesive layer. The chip unit includes a first surface and a second surface opposite to the first surface. The first surface is configured to receive a touch operation. The first adhesive layer is directly or indirectly attached to the second surface in a peelable manner.