Fingerprint Sensor Conductive Protective Cover
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Solution Overview
Problem
Existing fingerprint sensors face issues with the hardness of the dielectric layer, which can lead to scratching and a poor sensing effect, and protective layers can interfere with the functionality of the sensor.
Innovation Solution
A fingerprint sensor design that includes a substrate, photosensitive devices, a light-emitting module, and a protective cover with conductive structures electrically connected to the light-emitting module, ensuring that the fingerprint ridge is electrically connected to the light-emitting module without interference from the protective cover.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a protective layer is added to protect the light-emitting module, then the resistance to scratching is improved, but the electrical connection between fingerprint ridge and light-emitting module is blocked
Solution Approach 1:
The protective cover is segmented into multiple conductive structures that are electrically connected to the light-emitting module. Each conductive structure corresponds to a photosensitive device and provides a separate electrical connection path, allowing the protective cover to simultaneously protect against scratching and maintain electrical connection functionality.
Solution Approach 2:
The conductive structures in the protective cover act as intermediaries between the fingerprint ridge and the light-emitting module. They transmit electrical signals through the protective cover without being blocked by it, enabling the protective cover to fulfill both protective and conductive functions.
2Strength
If the dielectric layer is made harder to improve durability, then the resistance to damage is improved, but the sensing effect deteriorates
Solution Approach 1:
The protective cover is constructed from conductive materials that combine protective and electrical connection functions. This composite structure allows the outer layer to provide durability while the conductive components maintain sensing effectiveness by establishing proper electrical connections.
3Strength
If a protective cover is added to prevent scratching, then the protection against damage is improved, but the device complexity increases
Solution Approach 1:
The protective cover merges multiple functions into a single component: physical protection against scratching and electrical connection for sensing. The conductive structures are integrated directly into the protective cover, eliminating the need for separate protective and conductive layers, thus reducing overall device complexity.
Solution Approach 2:
The protective cover serves multiple purposes simultaneously: it protects the light-emitting module from scratching while also providing electrical connection paths through its conductive structures. This multi-functionality reduces the need for additional separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed design effectively reduces the probability of the light-emitting module being scratched and enhances the sensing effect by ensuring proper electrical connection and light emission, leading to accurate fingerprint detection.
Implementation Method 1
a plurality of photosensitive devices disposed on the substrate
Implementation Method 2
a light-emitting module disposed on a side, distal to the substrate, of the plurality of photosensitive devices
Data Source
AI summary
Provided is a fingerprint sensor, including: a substrate; a plurality of photosensitive devices disposed on the substrate; a light-emitting module disposed on a side, distal to the substrate, of the plurality of photosensitive devices; and a protective cover disposed on a side, distal to the substrate, of the light-emitting module, wherein the protective cover is provided with a plurality of conductive structures electrically connected to the light-emitting module, the plurality of conductive structures being in one-to-one correspondence with the plurality of photosensitive devices, and an orthographic projection of each conductive structure onto the substrate at least partially being overlapped with an orthographic projection of the photosensitive device corresponding to the conductive structure onto the substrate.