Fingerprint Sensor Package With Isolated Sensing Pattern Stack
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Solution Overview
Problem
Current fingerprint sensor technologies face challenges in enhancing reliability and sensitivity, particularly in the design and configuration of sensor packages for effective fingerprint recognition.
Innovation Solution
A fingerprint sensor package is designed with a film substrate, interconnection substrate, semiconductor chip, conductive structures, and an interposer substrate, featuring isolated sensing patterns and conductive structures to improve electrical connections and sensitivity, along with a mold layer and protection layer to enhance durability and sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conductive structures are placed in direct contact with the semiconductor chip, then electrical connection is simplified, but reliability deteriorates due to potential damage and interference
Solution Approach 1:
The patent introduces an interposer substrate as an intermediary component between the conductive structures and the semiconductor chip. This interposer substrate includes sensing patterns that are electrically connected to the conductive structures while being vertically isolated from direct contact with the semiconductor chip, thereby mediating the electrical connection while protecting the chip from potential damage
Solution Approach 2:
The patent transitions from a planar two-dimensional layout to a three-dimensional stacked architecture. The sensing patterns are arranged in multiple vertical layers (first sensing pattern layer and second sensing pattern layer) with vertical isolation between them, utilizing the vertical dimension to achieve both electrical connection and protection simultaneously
2Ease of manufacture
If sensing patterns are placed in direct contact with each other, then manufacturing is simplified, but sensitivity deteriorates due to electrical interference
Solution Approach 1:
The patent utilizes vertical layering to separate sensing patterns that would otherwise need to be laterally isolated. The first sensing patterns and second sensing patterns are positioned in different vertical layers with vertical isolation, allowing simpler lateral manufacturing while maintaining sensing sensitivity through vertical separation
Solution Approach 2:
The interposer substrate acts as an intermediary that electrically connects the conductive structures to the sensing patterns through the vertical isolation structure, enabling manufacturing simplicity while preventing electrical interference between sensing patterns through the vertical separation
3Device complexity
If the sensor package structure is simplified, then manufacturing is easier, but durability deteriorates due to increased damage risk to sensing patterns
Solution Approach 1:
The patent introduces a mold layer that surrounds and protects the conductive structures and sensing patterns from mechanical damage. This protective layer is positioned before final assembly, providing beforehand cushioning against potential harm during operation and handling
Solution Approach 2:
The patent employs a nested structure where the interposer substrate with sensing patterns is nested within the package structure, which is itself nested within the mold layer. This nested arrangement provides multiple layers of protection while maintaining a compact overall structure
Data Source
AI summary
A fingerprint sensor package may include a film substrate, an interconnection substrate on the film substrate, a semiconductor chip on the interconnection substrate, a conductive structure on the interconnection substrate and laterally isolated from direct contact with the semiconductor chip, and an interposer substrate on the semiconductor chip and the conductive structure. The conductive structure may include first and second conductive structures, which are electrically separated from each other. The interposer substrate may include a first sensing pattern electrically connected to the first conductive structure and a second sensing pattern on a top surface of the first sensing pattern and electrically connected to the second conductive structure. The second sensing pattern may be vertically isolated from direct contact with from the first sensing pattern. The second sensing pattern may have a longitudinal axis parallel to a direction crossing a longitudinal axis of the first sensing pattern, in a plan view.