Fingerprint Sensor Package with Multi-Layer Sensing Patterns

The fingerprint sensor is divided into multiple sensing patterns arranged in a matrix configuration, where each sensing pattern acts as an independent sensing element. This segmentation allows the sensor to achieve high resolution through multiple discrete points rather than requiring a large continuous sensing area, thereby improving recognition rate while controlling production costs.

The patent transitions from a single-layer sensing structure to a multi-layer structure with sensing patterns distributed across different levels. By stacking sensing patterns in multiple layers and directions, the sensor achieves enhanced resolution and recognition capability without proportionally increasing the planar area, thus avoiding excessive production costs.

The patent designs a universal sensing structure where sensing patterns, ground patterns, and insulating layers form a standardized multi-layer configuration that can be applied to various fingerprint sensor types and applications. This universal design maintains flexibility and ease of application while achieving high sensing accuracy through the standardized yet configurable pattern arrangement.

The patent employs thin film structures for insulating layers and conductive patterns that can be flexed and adapted to different form factors. The sensing patterns are formed as thin conductive layers that maintain electrical functionality while providing mechanical flexibility, allowing the sensor to be applied in various devices including wearable devices and smartphones.