Fingerprint Sensor Package Insulation Layer Integration
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Solution Overview
Problem
Current methods for producing biometric fingerprint sensors on PCB substrates are not suitable for mass production, as they are complex and lack cost-effectiveness and reliability, and silicon-based sensors face integration challenges in 35 mm chip card carrier tapes due to mechanical vulnerability.
Innovation Solution
A package design featuring a fingerprint sensor with an insulation layer and electrical connections that can be easily integrated into a chip card, using a standard 35 mm carrier tape for roll-to-roll production, allowing for easy assembly and integration using standard equipment, and incorporating a sensor module with an integrated antenna or exposed connections for secure connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If PCB-substrate-based biometric fingerprint sensors are produced from PCB panels using stamping, milling or cutting, then individual chip modules can be obtained, but the production method is not suitable for mass production and lacks cost-effectiveness
Solution Approach 1:
The patent divides the production process into modular components: a carrier tape with multiple recesses, each containing a sensor module. This segmentation allows parallel production of multiple sensors simultaneously on the carrier tape, enabling mass production while maintaining individual module integrity for subsequent chip card assembly.
Solution Approach 2:
The patent implements preliminary action by pre-assembling sensor modules onto the carrier tape with integrated electrical connections and insulation layers before final chip card production. This advance preparation standardizes the modules and enables efficient mass production and automated assembly into chip cards later.
2Ease of manufacture
If silicon-based sensor packages are secured to the carrier tape by means of an epoxy-based adhesive and wire bond connections, then the sensors can be integrated into chip cards, but the arrangement is mechanically vulnerable to damage from bending, torsion or pressure
Solution Approach 1:
The patent merges the electrical connection function and mechanical support function into a single integrated structure. The insulation layer with integrated electrical connections provides both electrical connectivity and mechanical support, eliminating the separate wire bond connections and epoxy adhesive that created mechanical vulnerability in previous designs.
Solution Approach 2:
The patent uses composite material structures combining insulation layers with integrated electrical connections, creating a unified component that provides both electrical functionality and mechanical strength. This composite approach replaces the vulnerable combination of separate adhesive and wire bond components.
3Adaptability or versatility
If a complex construction with multiple components electrically connected is used for biometric sensors, then functional capabilities are achieved, but the device complexity increases and cost-effectiveness decreases
Solution Approach 1:
The patent implements universality by designing the insulation layer to perform multiple functions simultaneously: providing electrical insulation, carrying electrical connections, and offering mechanical support. This multi-functionality reduces the number of separate components needed while maintaining full functional capability for biometric sensing and electrical connectivity.
Data Source
AI summary
A package including a frame having an opening for receiving a sensor module, wherein the frame comprises at least one electrical connection which is directed into the opening and which is arranged on an insulation layer applied to the frame, and wherein the insulation layer is connected to the frame at an insertion side of the frame, from which side the sensor module is to be inserted into the opening, and is bent along the inner side of the frame proceeding from the insertion side, such that the at least one electrical connection directed to the opening is electrically couplable to the associated sensor module connection in an arrangement.