Fingerprint Sensor Re-packaging for Cost Reduction
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Solution Overview
Problem
Current fingerprint sensor components in electronic devices are costly due to expensive packaging processes, and there is a need for further cost reduction while maintaining or improving sensitivity and manufacturing efficiency.
Innovation Solution
A method of re-packaging small fingerprint sensor components to a desired outline using a temporary carrier with dielectric material application and removal, along with the addition of material around the sides to define the component outline, allowing for cost-efficient manufacturing and improved sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging processes are used for fingerprint sensor components, then the component can be manufactured with proper protection and connectivity, but the production cost increases significantly
Solution Approach 1:
The patent separates the packaging process into two distinct stages: initial packaging of the IC die in a first package, and subsequent re-packaging in a second package with the desired component outline. This segmentation allows each packaging stage to be optimized independently, reducing overall manufacturing cost while maintaining protection.
Solution Approach 2:
The IC die is packaged in a first package with appropriate protection and connectivity before the re-packaging process. This preliminary packaging action ensures the die is protected during subsequent manufacturing steps, while allowing cost-effective final packaging to be performed on already-protected components.
2Ease of manufacture
If smaller fingerprint sensors are used to reduce cost, then the component size and initial cost decrease, but the component outline may not align with electronic device design specifications
Solution Approach 1:
A second package acts as an intermediary between the small IC die and the electronic device housing. This intermediate package provides the desired component outline and mounting features, allowing small fingerprint sensors to be adapted to various device designs without requiring custom packaging for each application.
Solution Approach 2:
The second package is designed with a standardized component outline and mounting structure that can accommodate different small fingerprint sensor ICs. This universal package design allows the same packaging approach to be used across multiple product lines and device types, improving adaptability while maintaining cost efficiency.
3Ease of manufacture
If re-packaging process is implemented to achieve desired component outline, then cost efficiency improves and sensitivity increases, but the manufacturing process complexity increases
Solution Approach 1:
The first package serves multiple functions: it provides initial protection for the IC die, maintains connectivity during handling, and facilitates the subsequent re-packaging process. This self-service approach allows the initial package to support subsequent manufacturing steps without requiring additional protective measures, simplifying the overall process despite the re-packaging step.
Data Source
AI summary
A method of manufacturing a fingerprint sensor component having a component outline for integration into an electronic device, the method comprising the steps of: providing a fingerprint sensor package having a sensing surface, a connection surface opposite the sensing surface, and sides connecting the sensing surface and the connection surface, the connection surface having connectors for allowing electrical connection of the fingerprint sensor component to the electronic device; arranging the fingerprint sensor package on a temporary carrier with the connection surface facing the temporary carrier; and adding material at least around the sides of the fingerprint sensor package, while leaving the connection surface of the fingerprint sensor package uncovered.