Fingerprint Sensor Package With Side-Exposed Connections for Thin Layouts
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Solution Overview
Problem
Existing fingerprint sensors face challenges in achieving miniaturization, reduced thickness, and increased sensitivity while maintaining reliability and lowering manufacturing costs.
Innovation Solution
A fingerprint sensor package design featuring a substrate with intersecting sensing patterns, a controller chip, and electrical connection structures, where at least one connection structure is exposed in a direction different from the substrate, allowing for efficient electrical connections and reduced overall size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the fingerprint sensor package is miniaturized and thinned, then the overall size and height are reduced, but the reliability and sensitivity of acquiring fingerprint information may deteriorate
Solution Approach 1:
The patent applies dimensionality change by exposing electrical connection structures in a direction different from the substrate's facing direction. Specifically, while the substrate and encapsulant face each other in the thickness direction (Z-axis), the electrical connection structures are exposed on the side surface (X or Y axis), allowing electrical connections without increasing the package thickness, thus maintaining miniaturization while ensuring reliable electrical connectivity.
2Volume of moving object
If the fingerprint sensor package is miniaturized and thinned, then the overall size and height are reduced, but the sensitivity of acquiring fingerprint information may deteriorate
Solution Approach 1:
The patent maintains sensitivity by preserving the integrity of the sensing patterns and controller chip through the encapsulant while exposing electrical connection structures in a lateral direction. This dimensional approach allows the sensing area to remain optimized for fingerprint acquisition without the constraints of traditional electrical connection layouts, thus maintaining measurement precision within a miniaturized package.
3Ease of manufacture
If electrical connection structures are exposed in the thickness direction, then electrical connections are simplified, but the package height increases
Solution Approach 1:
The patent resolves this contradiction by changing the exposure direction of electrical connection structures from the thickness direction (Z-axis) to the lateral direction (X or Y axis). This allows electrical connections to be established without increasing package height, while the encapsulant still provides protection and structural integrity.
4Ease of manufacture
If traditional electrical connection methods are used, then manufacturing is straightforward, but design freedom and connection efficiency are limited
Solution Approach 1:
The patent enhances design freedom by exposing electrical connection structures in a lateral direction rather than requiring thickness-direction exposure. This dimensional flexibility allows for more versatile package configurations, better integration with host devices, and optimized electrical connections without sacrificing manufacturing feasibility.
Data Source
AI summary
A fingerprint sensor package includes: a substrate including a plurality of first sensing patterns spaced apart from each other in a first direction and extending in a second direction, intersecting the first direction, and a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction; a controller chip electrically connected to the substrate; an encapsulant covering the controller chip; and a plurality of electrical connection structures electrically connected to the substrate and contacting the encapsulant, wherein at least one of the plurality of electrical connection structures is exposed from the encapsulant in a direction different from a direction in which the plurality of electrical connection structures and the substrate face each other.