Fingerprint Sensor Package Layout for Thin Reliable Wire Bonding
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Solution Overview
Problem
Conventional semiconductor packages and methods for forming sensor devices, such as fingerprint sensors, face issues with inadequate sensing accuracy, device reliability, manufacturability, and increased thickness, making them difficult and costly to integrate into other products.
Innovation Solution
The development of a fingerprint sensor package and manufacturing method that includes a substrate with conductive patterns, a semiconductor die with bond pads, a conductive wire connecting the die to the substrate, a dielectric layer, and a transparent plate attached to the dielectric layer without interfering with the conductive wire, all encapsulated with an insulative material, allowing for simplified manufacturing and improved integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional semiconductor packages are used for fingerprint sensors, then manufacturing processes are established, but sensing accuracy and device reliability are inadequate
Solution Approach 1:
The package structure is segmented into distinct functional layers: substrate, semiconductor die, dielectric layer, and transparent plate. This segmentation allows each layer to be optimized independently for its specific function, improving overall sensing accuracy and reliability while maintaining manufacturability
Solution Approach 2:
The patent transitions from conventional planar packaging to a three-dimensional stacked architecture where components are vertically arranged. This dimensional change enables better space utilization, improved signal paths, and enhanced sensing performance without increasing footprint area
2Ease of operation
If conventional sensor device structures are used, then device functionality is achieved, but device thickness increases
Solution Approach 1:
The patent employs a nested structure where the semiconductor die is mounted on the substrate, the dielectric layer encapsulates the bond wire, and the transparent plate covers the entire assembly. This nesting approach consolidates multiple components into a compact vertical stack, reducing overall device thickness while maintaining functionality
Solution Approach 2:
The dielectric layer is implemented as a thin film that encapsulates the bond wire and provides insulation. This thin-film approach minimizes vertical space occupation while maintaining electrical isolation, thereby reducing device thickness without compromising reliability
3Reliability
If conventional packaging methods are used, then device assembly is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The bond wire is encapsulated in the dielectric layer before final device assembly. This preliminary action protects the bond wire from mechanical stress and environmental damage during subsequent manufacturing steps, improving device reliability while simplifying the overall manufacturing process
Solution Approach 2:
The patent combines multiple functions into unified structures: the dielectric layer simultaneously provides electrical insulation, mechanical protection, and structural support. This merging of functions reduces the number of separate components and assembly steps, improving manufacturability while maintaining reliability
Data Source
AI summary
A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.