Fingerprint Identification Unit Integrated into Touch Panel
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Solution Overview
Problem
Conventional fingerprint identification units are bulky and have low sensitivity due to their integration with multiple layers and the need to form on a silicon wafer, and they are not effectively integrated into touch screens, leading to poor structural integration and convenience.
Innovation Solution
A fingerprint identification unit is formed on a base with multiple coating and electrode layers, allowing direct integration into touch panels or display modules, reducing thickness and enhancing sensitivity without the need for a silicon substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional fingerprint identification units are integrated with multiple layers and formed on silicon wafer, then structural completeness is achieved, but thickness increases and sensitivity decreases
Solution Approach 1:
The patent extracts and eliminates the silicon wafer substrate from the conventional fingerprint identification unit structure. By forming the fingerprint identification unit directly on the touch panel substrate without requiring a separate silicon wafer, the invention removes unnecessary layers and reduces overall thickness while maintaining functional completeness through direct integration of sensing electrodes and insulating layers.
Solution Approach 2:
The patent merges the fingerprint identification unit with the touch panel structure by forming both on the same substrate. The sensing electrodes of the fingerprint unit are integrated with the touch panel's electrode layers, and insulating layers are shared between the two functions. This consolidation eliminates separate substrates and reduces thickness while maintaining both touch sensing and fingerprint identification capabilities.
2Reliability
If conventional fingerprint identification units are integrated with multiple layers and formed on silicon wafer, then structural completeness is achieved, but fingerprint identification sensitivity decreases
Solution Approach 1:
The patent extracts the silicon wafer substrate that was causing signal attenuation and sensitivity reduction. By eliminating this intermediate substrate and forming the fingerprint sensing electrodes directly on the touch panel substrate, the invention improves electrical signal transmission quality and enhances fingerprint identification sensitivity while maintaining structural functionality.
Solution Approach 2:
The patent introduces a conductive adhesive layer as an intermediary between the fingerprint sensing electrodes and the touch panel substrate. This conductive layer improves electrical connection quality and signal transmission compared to conventional non-conductive adhesives, thereby enhancing fingerprint identification sensitivity while maintaining structural integrity.
3Ease of manufacture
If conventional fingerprint identification units are separately mounted, then manufacturing simplicity is maintained, but structural integration and convenience decrease
Solution Approach 1:
The patent merges the fingerprint identification unit fabrication process with the touch panel manufacturing process. Both units are formed on the same substrate using similar thin-film deposition and patterning techniques, allowing simultaneous production without requiring separate mounting steps. This integrated approach enhances structural integration while maintaining manufacturing simplicity through process consolidation.
Data Source
AI summary
A fingerprint identification unit is directly integrated into a touch panel, a Color Filter (CF), a Thin-Film Transistor (TFT), or a Liquid Crystal Module (LCM) to largely increase the identified sensitivity to solve the problem of the conventional fingerprint identification unit that is required to form on a silicon wafer first.