Finned Backing Plate for PCB Thermal Management
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Solution Overview
Problem
Integrated circuits (ICs) face challenges in heat dissipation due to limitations in heatsink size and thermal efficiency, leading to inadequate cooling solutions despite structural backing plates on printed circuit boards (PCBs).
Innovation Solution
A configurable backing plate with fins is introduced, which acts as a further heatsink, providing increased surface area for heat transfer and thermal contact with both sides of the PCB to enhance cooling, complementing the conventional heatsink on the top side.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heatsink size is increased to improve heat dissipation, then heat dissipation capability is improved, but system design constraints are violated
Solution Approach 1:
The invention utilizes the third dimension by placing fins on the backing plate beneath the PCB, effectively adding a bottom-side heat dissipation path. This dimensional expansion allows heat dissipation without increasing the lateral footprint of the heatsink on the PCB surface, thereby resolving the contradiction between heat dissipation capability and system design constraints.
Solution Approach 2:
The backing plate is transformed from a purely structural component to a multi-functional element that simultaneously provides mechanical support and thermal dissipation. By integrating fins into the backing plate, it becomes an active heatsink component, enabling dual functionality without requiring additional space or components.
2Temperature
If conventional heatsink is used on top side of PCB, then heat dissipation is provided, but PCB deflection occurs due to clamping force
Solution Approach 1:
The invention applies counterbalancing clamping forces by securing the heatsink to both the top and bottom sides of the PCB. The backing plate with fins on the bottom side provides a counterweight effect that offsets the deflection caused by the top-side heatsink clamping force, thereby stabilizing the PCB and preventing warping while maintaining effective heat dissipation.
3Volume of moving object
If heatsink size is limited due to system constraints, then system design requirements are met, but heat dissipation capability is insufficient
Solution Approach 1:
The invention effectively doubles the heat dissipation surface area by utilizing both sides of the PCB - the top side with the conventional heatsink and the bottom side with the backing plate fins. This dimensional utilization allows the system to meet size constraints while achieving sufficient heat dissipation capability through bidirectional thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The backing plate with fins effectively dissipates heat from components, reducing the thermal load on the conventional heatsink and improving cooling performance in both forced and natural convection designs, while preventing PCB warping through balanced clamping forces.
Implementation Method 1
remove heat from the component through a solid portion of the printed circuit board
Implementation Method 2
improving cooling performance in both forced and natural convection designs
Data Source
AI summary
A backing plate is provided. The backing plate is configurable to attach with at least one fastener to a heatsink with the heatsink on a first face of a printed circuit board and in thermal contact with a surface of a component mounted to the first face of the printed circuit board and the backing plate on a second, opposed face of the printed circuit board and in thermal contact with the second face of the printed circuit board. The backing plate has a plurality of fins and configurable to act as a further heatsink for the component and remove heat from the component through a solid portion of the printed circuit board.