Fish-Bone Capacitor Structure for High Density
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in semiconductor technology is to increase the density and capacitance of electrical elements in integrated circuits while maintaining their smaller sizes, which existing capacitor structures have not effectively addressed.
Innovation Solution
A capacitor structure is designed with a first and second metal structure, each comprising conductive components with a fish-bone shape, where the dielectric material is placed between and within these structures, forming isolators and increasing capacitance without connections via between them.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional capacitor structures are used, then the circuit area is reduced, but the capacitance value and capacitor density cannot be sufficiently increased
Solution Approach 1:
The metal structures are divided into multiple conductive components (first, second, third, fourth conductive components) arranged in a fish-bone pattern. This segmentation increases the effective capacitance area without proportionally increasing the overall structure complexity, as the segmented components are systematically organized rather than randomly distributed.
Solution Approach 2:
The patent transitions from traditional planar capacitor layouts to a three-dimensional stacked configuration with metal structures at different levels (first and second metal structures) connected via conductive vias. This dimensional change allows capacitance to be accumulated in both lateral and vertical directions, significantly increasing capacitor density without linearly increasing footprint area.
2Quantity of substance
If the capacitor size is reduced to increase density, then the capacitor density increases, but the capacitance value may be insufficient
Solution Approach 1:
Multiple conductive components are nested within each other in a fish-bone configuration, where inner conductive components are surrounded by outer ones. This nesting allows the capacitor to accumulate capacitance through multiple concentric layers, effectively increasing the capacitance value within a compact volume without requiring proportional increases in external dimensions.
Solution Approach 2:
The capacitor employs a composite structure combining multiple metal layers (first and second metal structures), dielectric materials filling the spaces between conductive components, and conductive vias for inter-layer connections. This composite approach optimizes the capacitance-to-volume ratio by strategically selecting and arranging materials with different electrical and physical properties.
3Quantity of substance
If more conductive components are added to increase capacitance, then the capacitance value increases, but the manufacturing complexity increases
Solution Approach 1:
The fish-bone shaped conductive components serve multiple functions: they act as capacitor plates for storing charge, provide structural framework for the capacitor, and their arranged configuration creates natural isolation regions. This multi-functionality reduces the need for additional separate components, thereby increasing capacitance without proportionally increasing manufacturing complexity.
Solution Approach 2:
Dielectric materials are positioned as intermediaries filling the spaces between adjacent conductive components and between the first and second metal structures. These dielectric intermediaries enable the addition of multiple conductive components while maintaining electrical isolation, allowing capacitance to be increased through additional conductive elements without causing short circuits or requiring complex isolation structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a higher capacitance value and increased capacitor density without sacrificing the quality factor, enabling more efficient use of space in integrated circuits.
Implementation Method 1
The capacitor structure includes a first metal structure, a second metal structure, and a dielectric material. The dielectric material is disposed between the first metal structure and the second metal structure.
Implementation Method 2
The dielectric material is disposed in a plurality of isolators of the first metal structure, in a plurality of isolators of the second metal structure, and between the first metal structure and the second metal structure.
Data Source
AI summary
A capacitor structure includes a first metal structure, a second metal structure, and a dielectric material. The second metal structure is disposed below the first metal structure. Each of the first metal structure and the second metal structure includes at least three conductive components. The conductive components have a fish-bone shape. The dielectric material is disposed in a plurality of isolators of the first metal structure, in a plurality of isolators of the second metal structure, and between the first metal structure and the second metal structure.