Five-Sided Insulated Components for Tight-Pitch Electronic Packages
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Solution Overview
Problem
The increasing integration and density of electronic components in surface mount technology lead to tighter pitches between semiconductor dies or packages, resulting in gaps less than 50 μm, which are prone to short issues or bridge defects due to limitations in machine precision and material tolerances, necessitating improved insulation.
Innovation Solution
A five-sided insulated electronic component with a cuboid shape, featuring a conductive structure on the bottom side and an insulating layer on the non-bottom sides, is developed to enhance insulation, allowing for effective coating processes such as dipping or spraying to ensure proper separation between adjacent components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the pitch between electronic components is reduced to increase integration density, then the integration density is improved, but the risk of electrical shorts and bridge defects increases due to machine precision limitations and material tolerances
Solution Approach 1:
The patent applies preliminary action by forming an insulating layer on the electronic components before mounting them on the substrate. This pre-coating approach ensures that insulation is already in place before components are positioned at tight pitches, preventing electrical shorts that would otherwise occur due to machine precision limitations and material tolerances when gaps are reduced to below 50 μm.
Solution Approach 2:
The insulating layer acts as an intermediary substance between adjacent electronic components. This intermediate layer provides the necessary electrical isolation, allowing components to be placed at reduced pitches while maintaining reliable electrical insulation. The coating material serves as a mediator that enables tighter integration without compromising insulation reliability.
2Reliability
If a insulating layer is added to electronic components, then the electrical insulation is improved, but the device complexity and manufacturing process complexity increase
Solution Approach 1:
The patent merges the insulation function with the component structure by integrating the insulating layer directly onto the electronic components during the coating process. This combination approach adds the necessary insulation functionality without requiring separate insulation structures or additional discrete insulation components, thereby limiting the increase in device complexity.
Solution Approach 2:
The insulating layer serves multiple functions simultaneously: it provides electrical insulation between components, acts as a protective coating, and enables reduced pitch placement. This multi-functionality approach adds insulation capability without proportionally increasing device complexity, as the same structural addition delivers multiple benefits.
3Reliability
If a insulating layer is added to electronic components, then the electrical insulation is improved, but the manufacturing process complexity increases
Solution Approach 1:
The coating process is designed to be self-service by automatically applying the insulating material to components as they pass through the coating apparatus. The system uses gravity-fed material delivery and automated coating application, reducing the need for manual intervention and complex manufacturing steps while ensuring consistent insulation coverage on all components.
Data Source
AI summary
An electronic package comprises: a substrate; five-sided insulated electronic components, wherein each of the five-sided insulated electronic components comprises: a raw electronic component having a cuboid shape, wherein the raw electronic component has a bottom side at which the raw electronic component is mounted onto and connected with the substrate and five non-bottom sides; a conductive structure disposed on the bottom side of the raw electronic component; and an insulating layer disposed on the five non-bottom sides of the raw electronic component.