Five-Sided Semiconductor Package for Higher PCB Mounting Density
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Solution Overview
Problem
The challenge is to reduce the size of electronic device packages for higher circuit density and lower manufacturing costs while maintaining effective electrical connections and assembly on printed circuit boards, as existing small outline no-lead (SON) packages face limitations in miniaturization and cost efficiency.
Innovation Solution
A five-sided electronic device package structure with a triangular shape is fabricated using a lead frame panel with angled metal bars and conductive leads, allowing for concurrent processing and increased density, where the package structure encloses the semiconductor die and exposes leads for soldering, and a method involving die attach, wire bonding, molding, and angled cutting to separate individual devices from a panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional small outline no-lead (SON) packages are used, then electrical connections and assembly on PCBs are maintained, but package size cannot be reduced further and manufacturing costs remain high
Solution Approach 1:
The package structure is divided into five distinct sides (first side with top surface, second side with bottom surface, third and fourth lateral sides, and fifth end side), allowing optimized lead arrangement and compact geometry. This segmentation enables reduced package volume while maintaining all necessary electrical connection points for PCB assembly.
Solution Approach 2:
The patent transitions from conventional two-dimensional lead arrangements to a three-dimensional five-sided package structure with leads distributed across multiple faces. The third and fourth sides provide additional lead exposure surfaces, effectively utilizing spatial dimensions to increase circuit density without increasing footprint area, thereby reducing overall package size while maintaining manufacturability.
2Volume of moving object
If package size is reduced for higher circuit density, then smaller packages are achieved, but manufacturing complexity increases
Solution Approach 1:
The package employs an asymmetric five-sided geometry where the third and fourth sides extend in orthogonal directions from the first side, creating an irregular polyhedral shape rather than a symmetric form. This asymmetric design optimizes lead distribution and package footprint, achieving compact size while the regularity of the five-sided structure keeps manufacturing processes manageable.
Solution Approach 2:
The package structure utilizes planar faceted surfaces meeting at edges and corners, creating a polyhedral form that approximates a compact geometric shape. This faceted design allows for efficient space utilization and reduced volume while maintaining manufacturability through standard molding and cutting processes, avoiding the complexity of truly curved surfaces.
3Quantity of substance
If leads are exposed along multiple sides for increased circuit density, then more connection points are available, but manufacturing precision requirements increase
Solution Approach 1:
Leads are segmented and distributed across five distinct sides of the package, with specific leads exposed along the third side extending in one orthogonal direction and other leads exposed along the fourth side extending in a different orthogonal direction. This segmentation allows each lead group to be independently positioned and connected, increasing the total number of connection points while managing manufacturing precision through modular lead arrangement.
Data Source
AI summary
An electronic device includes a package structure, a semiconductor die and a set of conductive leads, in which the package structure has a triangular shape with a bottom first side, a top second side and lateral third, fourth, and fifth sides. The set of conductive leads extend along the third side with one of the set of conductive leads electrically coupled to a conductive terminal of the semiconductor die, the package structure encloses a portion of the semiconductor die and portions of the set of conductive leads, and the package structure exposes further portions of the set of conductive leads along the first side and additional portions of the set of conductive leads along the third side.